Soldering device

Patent metadata

Field	Value
Publication number	US-10569351-B2
Application number	US-201616321981-A
Country	US
Kind code	B2
Filing date	Aug 1, 2016
Priority date	Aug 1, 2016
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

A control device of soldering device identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component.

First claim

The invention claimed is:

1. A soldering device comprising:
a soldering device to solder leads of multiple lead component types mounted on a board by jetting molten solder reserved in a solder bath;
a memory to store correspondences between the lead component types and a value of a soldering parameter; and
a moving device to move the soldering device;
a control device configured to identify the lead component type to be soldered when sequentially soldering the multiple types of lead components by the soldering device, read out a value of the soldering parameter corresponding to the lead component type identified from the correspondences stored in the memory, and to control the soldering device so that the lead of the lead component is soldered based on the value of the soldering parameter read out, wherein
the soldering parameter includes a solder withdrawal speed, and
the control device controls the moving device so that the soldering device is moved downwards below the lead component after the soldering device ends its soldering operation at the solder withdrawal speed.

2. The soldering device of claim 1 , wherein the soldering parameter also includes at least one of:
a flux heating time during which flux adhering to the board is heated before the molten solder is applied to the lead of the lead component;
a solder application time during which the molten solder is applied to the lead of the lead component;
a solder curing waiting time during which solder is allowed to cure while the lead component is supported to be raised from the board;
a tracing soldering speed at which the soldering device is moved in the direction in which leads are aligned in a case where the lead component includes a number of leads;
a height of the soldering device relative to the lead of the lead component, and a jetting height of the molten solder.

3. The soldering device according to claim 2 , wherein
the soldering parameter includes the flux heating time, the soldering device has a gas injecting section configured to inject nitrogen gas heated by heat of the molten solder, and
the control device controls the gas injecting section so that the nitrogen gas injected from the gas injecting section heats the flux during the flux heating time included in the value of the soldering parameter read out.

4. The soldering device according to claim 1 , wherein
the soldering parameter includes the solder curing waiting time, the soldering device having a component support section configured to support the lead component to be raised away from the board, and the control device controls the component support section so that the component support section supports the lead component with being raised away from the board for the duration of the solder curing waiting time included in the value of the soldering parameter read out.

5. The soldering device according to claim 1 wherein
the soldering device being integrated with a component mounting device configured to hold the lead component supplied from a component supply device and move the lead component to a predetermined position on the board so that the lead of the lead component is inserted into a through hole provided in the predetermined position.

Assignees

• Fuji Corp

Inventors

• Otsubo Satoru
• Iwaki Noriaki

Classifications

• B23K1/08 Primary

  Soldering by means of dipping in molten solder · CPC title

• H05K3/34

  by soldering · CPC title

• B23K2101/40

  Semiconductor devices · CPC title

• B23K20/00

  Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating · CPC title

• B23K1/085

  Wave soldering · CPC title