Semiconductor device and manufacturing method of semiconductor device
US-2017355040-A1 · Dec 14, 2017 · US
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K20/00 |
| Official title | Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating |
| Display label | Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating |
| Total patents | 267 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 20 |
| 2017 | 22 |
| 2018 | 20 |
| 2019 | 29 |
| 2020 | 24 |
| 2021 | 26 |
| 2022 | 27 |
| 2023 | 28 |
| 2024 | 26 |
| 2025 | 21 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and device for prefixing of substrates
US-2017345690-A1 · Nov 30, 2017 · US
Pellicle support frame and production method
US-2017343894-A1 · Nov 30, 2017 · US
Conductive bonded assembly of electronic component, semiconductor device using same, and method of production of conductive bonded assembly
US-2017317048-A1 · Nov 2, 2017 · US
Method for forming a directionally solidified replacement body for a component using additive manufacturing
US-9770758-B2 · Sep 26, 2017 · US
Bonding material and bonding method using same
US-2017252874-A1 · Sep 7, 2017 · US
Composite substrate and method for producing same
US-9754815-B2 · Sep 5, 2017 · US
Bonded Substrate, Method for Manufacturing the Same, and Support Substrate for Bonding
US-2017221786-A1 · Aug 3, 2017 · US
Method for bonding stainless steel members and stainless steel
US-2017197275-A1 · Jul 13, 2017 · US
Method for bonding stainless steel members and stainless steel
US-2017197276-A1 · Jul 13, 2017 · US
Method for joining dissimilar engine components
US-2017173729-A1 · Jun 22, 2017 · US
Method for forming a directionally solidified replacement body for a component using additive manufacturing
US-2017144219-A1 · May 25, 2017 · US
Beaded matrix and method of producing the same
US-2017145795-A1 · May 25, 2017 · US
Nickel particle composition, bonding material, and bonding method in which said material is used
US-2017136585-A1 · May 18, 2017 · US
Cooking vessel and manufacturing method
US-2017119190-A1 · May 4, 2017 · US
Bonding material and bonding method using same
US-2017120395-A1 · May 4, 2017 · US
Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
US-9601350-B2 · Mar 21, 2017 · US
Bonding material and bonding method using same
US-2017077057-A1 · Mar 16, 2017 · US
Method for bonding stainless steel members and stainless steel
US-2017072503-A1 · Mar 16, 2017 · US
Method for joining dissimilar engine components
US-9586868-B2 · Mar 7, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K20/00?
- CPC B23K20/00 is the Cooperative Patent Classification code for “Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating.”
- How many patents are filed under CPC B23K20/00 (Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating)?
- Our database includes 267 publications tagged with this CPC code.
- Is patent activity under CPC B23K20/00 growing?
- Publication counts under this code: 26 in 2024 vs 21 in 2025 (latest complete years).