Selective deposition of dielectric materials

Patent metadata

Field	Value
Publication number	US-10553480-B2
Application number	US-201815970636-A
Country	US
Kind code	B2
Filing date	May 3, 2018
Priority date	May 4, 2017
Publication date	Feb 4, 2020
Grant date	Feb 4, 2020

Abstract

The present disclosure relates to a method for selectively forming a dielectric material on a first area of a top surface of a substrate. In an embodiment, the method involves providing the substrate including the top surface, the top surface including the first area and a second area, the first area having a hydrophilicity characterized by a water contact angle of at least 45° and the second area having a hydrophilicity characterized by a water contact angle of less than 40°. The method also involves providing a precursor aqueous solution on the substrate, the precursor aqueous solution including: a solvent, a dielectric material precursor, a catalyst for forming a dielectric material from the dielectric material precursor, and an ionic surfactant. Further, the method involves removing the solvent.

First claim

What is claimed is:

1. A method for forming a dielectric material selectively on a first area of a top surface of a substrate, comprising:
providing the substrate comprising the top surface, the top surface comprising the first area and a second area, the first area having a hydrophilicity characterized by a water contact angle of at least 45°and the second area having a hydrophilicity characterized by a water contact angle of less than 40°;
providing a precursor aqueous solution on the substrate, the precursor aqueous solution comprising:
(i) a solvent;
(ii) a dielectric material precursor;
(iii) a catalyst for forming a dielectric material from the dielectric material precursor, wherein the dielectric material defines one or more sidewalk of at least one opening therein, the at least one opening exposing at least part of the second area; and
(iv) an ionic surfactant;

removing the solvent; and
forming an electrical contact in the at least one opening on at east part of the exposed second area.

2. The method of claim 1 , wherein the dielectric material comprises silica or an organosilica.

3. The method of claim 1 , wherein the dielectric material is a first dielectric material, and wherein the first area comprises a second dielectric material.

4. The method of claim 1 , wherein the second area comprises a metal.

5. The method of claim 4 , further comprising:
reducing at least a top surface of the metal.

6. The method of claim 1 , wherein the second area comprises a self-assembled monolayer haying a polar end-group.

7. The method of claim 1 , wherein the dielectric material precursor is selected from the group consisting of: triethoxymethylsilane, bis(triethoxysilyl)methane, bis(triethoxysilyl)ethane, 1,1,3,3,5,5-hexaethoxy-1,3,5-trisilacyclohexane, and tetraethyl orthosilicate.

8. The method of claim 1 , wherein the ionic surfactant is a cationic surfactant.

9. The method of claim 8 , wherein the ionic surfactant is cetyltrimethylammonium chloride.

10. The method of claim 1 , wherein providing the precursor aqueous solution on the substrate comprises spin coating the aqueous solution on the substrate.

11. The method of claim 1 , further comprising:
removing the ionic surfactant from the dielectric material, thereby forming a low-k dielectric material.

12. The method of claim 1 , wherein removing the solvent comprises heating the provided precursor aqueous solution at a temperature between 100° C. to 600° C.

13. The method of claim 1 , wherein removing the solvent comprises heating the provided precursor aqueous solution at a temperature between 350° C. to 450° C.

14. The method of claim 1 , wherein providing the substrate comprising the top surface comprises surface engineering at least one of the first and the second area such that the first area has the water contact angle of at least 45° and the second area has the water contact angle of less than 40°.

15. The method of claim 1 , wherein providing the precursor aqueous solution comprises forming the precursor aqueous solution, wherein forming the precursor aqueous solution comprises:
(i) forming a matrix solution by mixing a part of the solvent, the catalyst, the dielectric material precursor, and a first solvent;
(ii) forming a template solution by mixing the ionic surfactant and a second solvent; and
(iii) mixing the matrix solution with the template solution.

16. A semiconductor structure, comprising:
a substrate comprising a top surface, the top surface comprising a first area and a second area, the second area having a hydrophilicity characterized by a water contact angle of less than 40° and the first area having a hydrophilicity characterized by a water contact angle of at least 45°;
a dielectric material present at least on the first area, wherein the dielectric material defines one or more sidewalls of at least one opening therein, the at least one opening exposing at least part of the second area; and
an electrical contact in the at least one opening on at least part of the exposed second area.

17. The semiconductor structure of claim 16 , wherein the dielectric material is a low-k material.

18. The semiconductor structure of claim 16 , wherein the dielectric material is present only on the first area.

19. The semiconductor structure of claim 16 , wherein the dielectric material comprises silica or an organosilica.

20. The semiconductor structure of claim 16 , wherein the dielectric material is formed by providing a precursor aqueous solution on the substrate, the precursor aqueous solution comprising:
(i) a solvent;
(ii) a dielectric material precursor;
(iii) a catalyst for forming a dielectric material from the dielectric material precursor; and
(iv) an ionic surfactant.

Assignees

• Imec Vzw

Inventors

• Redzheb Murad
• Armini Silvia

Classifications

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P14/6922 Primary

  the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC · CPC title

• H10P14/6686

  the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane · CPC title

• H10P14/6502

  of treatments performed before formation of the materials · CPC title