Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-10550468-B2
Application number	US-201715422018-A
Country	US
Kind code	B2
Filing date	Feb 1, 2017
Priority date	Feb 2, 2016
Publication date	Feb 4, 2020
Grant date	Feb 4, 2020

Abstract

A substrate processing apparatus includes a transfer chamber; an upper gas supply mechanism for supplying a gas into an upper region of the transfer chamber through a first gas supply port; and a lower gas supply mechanism configured to supply the gas into a lower region of the transfer chamber through a second gas supply port. The upper gas supply mechanism includes a first buffer chamber at a back surface of the first gas supply port; a pair of upper ducts at both sides of the first buffer chamber; and a first ventilation unit at lower ends of the pair of upper ducts. The lower gas supply mechanism includes a second buffer chamber at a back surface of the second gas supply port; a lower duct at lower surface of the second buffer chamber; and a second ventilation unit at a lower end of the lower duct.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a transfer chamber where a substrate is transferred into a substrate retainer;
an upper gas supply mechanism configured to supply a gas into an upper region of the transfer chamber through a first gas supply port; and
a lower gas supply mechanism disposed under the upper gas supply mechanism and configured to supply the gas into a lower region of the transfer chamber through a second gas supply port,
wherein the upper gas supply mechanism comprises:
a first buffer chamber disposed at a back surface of the first gas supply port;
a pair of upper ducts disposed at both sides of the first buffer chamber; and
a first ventilation unit disposed at lower ends of the pair of upper ducts, and

the lower gas supply mechanism comprises:
a second buffer chamber disposed at a back surface of the second gas supply port;
a lower duct disposed at lower surface of the second buffer chamber; and
a second ventilation unit disposed at a lower end of the lower duct.

2. The substrate processing apparatus of claim 1 , wherein the first ventilation unit comprises two ventilation units disposed at the lower ends of the pair of upper ducts to correspond to the pair of upper ducts, and the second ventilation unit disposed between the two ventilation units.

3. The substrate processing apparatus of claim 2 , wherein the first buffer chamber is larger than the second buffer chamber.

4. The substrate processing apparatus of claim 3 , wherein the pair of upper ducts extends from an upper end of the first buffer chamber along both sides of the second buffer chamber to the lower end of the lower duct.

5. The substrate processing apparatus of claim 3 , wherein the lower duct has funnel shape when viewed from front.

6. The substrate processing apparatus of claim 5 , wherein a cross-section of the upper duct gradually narrows toward an upper direction.

7. The substrate processing apparatus of claim 1 , further comprising a gas dispersion unit disposed at one of the first gas supply port and the second gas supply port or both of the first gas supply port and the second gas supply port.

8. The substrate processing apparatus of claim 7 , wherein the gas dispersion unit comprises: a panel provided with third gas supply ports disposed on an entire surface thereof; and a third buffer chamber disposed behind the panel.

9. The substrate processing apparatus of claim 8 , wherein the panel is larger than the first gas supply port.

10. The substrate processing apparatus of claim 9 , wherein the panel comprises a punched member provided with the third gas supply ports, and an opening ratio of a center portion of the panel is different from an opening ratio of a side portion of the panel.

11. The substrate processing apparatus of claim 10 , wherein the opening ratio of the center portion is greater than the opening ratio of the side portion.

12. The substrate processing apparatus of claim 11 , wherein an area of the center portion is same as an area of the first gas supply port.

Assignees

• Hitachi Int Electric Inc
• Kokusai Electric Corp

Inventors

• Nakada Takayuki
• Taniyama Tomoshi
• Shirako Kenji

Classifications

• C23C16/54 Primary

  Apparatus specially adapted for continuous coating · CPC title

• H10P72/3406

  involving removal of lid, door or cover · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title