Package structure of capacitive coupling isolator

Patent metadata

Field	Value
Publication number	US-10541195-B2
Application number	US-201816165763-A
Country	US
Kind code	B2
Filing date	Oct 19, 2018
Priority date	Jan 29, 2018
Publication date	Jan 21, 2020
Grant date	Jan 21, 2020

Abstract

A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.

First claim

What is claimed is:

1. A package structure for a capacitive coupling isolator, comprising:
a first leadframe, including:
a first signal input pin;
a second signal input pin; and
a first electrode plate including a first signal input positive electrode plate, a first signal input negative electrode plate, a second signal input positive electrode plate and a second signal input negative electrode plate separated from each other;

a second leadframe corresponding to, aligning with and separated from the first leadframe, the second leadframe including:
a first signal output pin;
a second signal output pin; and
a second electrode plate including a first signal output positive electrode plate, a first signal output negative electrode plate, a second signal output positive electrode plate and a second signal output negative electrode plate separated from each other;

a transmitter disposed on the first leadframe and electrically connected to the first signal input pin, the second signal input pin and the first electrode plate;
a receiver disposed on the second leadframe and electrically connected to the first signal output pin, the second signal output pin and the second electrode plate;
a package body enclosing the first leadframe and the second leadframe, the package body being filled between the first leadframe and the second leadframe for electrically isolating the first leadframe and the second leadframe from each other;
wherein the first electrode plate and the second electrode plate are arranged one above each other and aligned with each other for forming a plurality of capacitors.

2. The package structure according to claim 1 , wherein the first leadframe further includes a first direct current pin and a first grounding pin both electrically connected to the transmitter, and the second leadframe further includes a second direct current pin and a second grounding pin electrically connected to the receiver.

3. The package structure according to claim 1 , wherein the transmitter and the receiver are both operated in differential modes.

4. The package structure according to claim 1 , wherein the first signal input pin, the second signal input pin and the first electrode plate are disposed on a same side of the transmitter, and the first signal output pin, the second signal output pin and the second electrode plate are disposed on a same side of the receiver.

5. The package structure according to claim 1 , wherein any two of the first signal input pin, the second signal input pin and the first electrode plate are respectively disposed on two different sides of the transmitter, and any two of the first signal output pin, the second signal output pin and the second electrode plate are disposed on two different sides of the receiver.

6. The package structure according to claim 1 , wherein a polyimide film is disposed between the first leadframe and the second leadframe, and the package body is filled between the first leadframe, the second leadframe and the polyimide film.

7. The package structure according to claim 1 , wherein the first signal input positive electrode plate and the first signal output positive electrode plate are aligned with each other for forming a first positive physical link, and the first signal input negative electrode plate and the first signal output negative electrode plate are aligned with each other for forming a first negative physical link, wherein the second signal input positive electrode plate and the second signal output positive electrode plate are aligned with each other for forming a second positive physical link, and the second signal input negative electrode plate and the second signal output negative electrode plate are aligned with each other for forming a second negative physical link, the first positive physical link and the first negative physical link together forming a first communication channel, and the second positive physical link and the second negative physical link together forming a second communication channel.

8. The package structure according to claim 1 , wherein the transmitter and the receiver are respectively disposed on two surfaces opposite to each other and each belonging to the first leadframe and the second leadframe.

9. The package structure according to claim 1 , wherein the transmitter and the receiver are respectively disposed on two surfaces facing each other and each belonging to the first leadframe and the second leadframe.

10. The package structure according to claim 1 , wherein the transmitter and the receiver are respectively disposed on two surfaces facing a same direction and each belonging to the first leadframe and the second leadframe.

Assignees

• Lite On Singapore Pte Ltd

Inventors

• Wang You-Fa
• Lai wei-wen
• Lin Pu-Han
• Wu Yuan-Lung

Classifications

• H10W90/811

  Multiple chips on leadframes · CPC title

• H10W70/451

  Multilayered leadframes · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W70/475

  Capacitors in combination with leadframes · CPC title

• H10W70/421

  Shapes or dispositions · CPC title