Nanofabrication using a new class of electron beam induced surface processing techniques

Patent metadata

Field	Value
Publication number	US-10538844-B2
Application number	US-201514851962-A
Country	US
Kind code	B2
Filing date	Sep 11, 2015
Priority date	Sep 11, 2015
Publication date	Jan 21, 2020
Grant date	Jan 21, 2020

Abstract

Methods and systems for direct lithographic pattern definition based upon electron beam induced alteration of the surface chemistry of a substrate are described. The methods involve an initial chemical treatment for global definition of a specified surface chemistry (SC). Electron beam induced surface reactions between a gaseous precursor and the surface are then used to locally alter the SC. High resolution patterning of stable, specified surface chemistries upon a substrate can thus be achieved. The defined patterns can then be utilized for selective material deposition via methods which exploit the specificity of certain SC combinations or by differences in surface energy. It is possible to perform all steps in-situ without breaking vacuum.

First claim

We claim as follows:

1. A method of charged particle beam processing selective areas of a surface, the method comprising:
performing a first workpiece surface modification that activates delocalized regions on the workpiece surface;
loading the workpiece into the sample chamber of an electron beam system;
introducing a precursor gas into the sample chamber;
performing a second workpiece surface modification using an electron beam in the presence of the precursor gas, wherein the second workpiece surface modification using the electron beam in the presence of the precursor as passivates specific, localized regions on the workpiece surface; and
affixing material to the activated regions on the workpiece surface.

2. The method of claim 1 , further comprising cyclically repeating the steps of:
performing first and second workpiece surface modifications; and
affixing material to activated regions on the workpiece surface.

3. The method of claim 2 , further comprising varying whether the workpiece surface activation step is the first or second workpiece surface modification for subsequent workpiece surface processing cycles.

4. The method of claim 1 , further comprising performing the first workpiece surface modification in an in-situ process.

5. The method of claim 1 , further comprising performing the first workpiece surface modification in an ex-situ process.

6. The method of claim 1 , wherein affixing material to the activated regions on the workpiece surface comprises growing a deposition on the activated regions of the workpiece surface.

7. The method of claim 6 , wherein growing a deposition on the activated regions comprises growing a deposition on the activated regions of the workpiece surface by chemical vapor deposition.

8. The method of claim 6 , wherein growing a deposition on the activated regions comprises growing a deposition on the activated regions of the workpiece surface by a wet process in which deposition nucleation only occurs on activated regions on the workpiece surface.

9. The method of claim 6 , wherein affixing material to the activated regions on the workpiece surface comprises attaching nanoparticles to the workpiece surface.

10. The method of claim 1 , wherein the first workpiece surface modification comprises forming a self-assembled monolayer on the workpiece surface.

11. The method of claim 1 , in which the second workpiece modification further comprises altering the surface with a resolution smaller than full width half maximum (FWHM) size of the electron beam.

12. The method of claim 1 , wherein one or both of the first and second workpiece surface modifications comprises modification of surface termination properties.

13. The method of claim 1 , wherein the performing the second workpiece surface modification comprises using the electron beam to decompose the precursor gas in the so as to passivate the specific, localized regions on the workpiece surface.

14. The method of claim 13 , wherein the using the electron beam to decompose the precursor gas comprises decomposing the gas when a beam dose of the electron beam exceeds a threshold value.

15. The method of claim 1 , wherein a first portion of the electron beam incident on the workplace surface has a first beam dose that is above a threshold value, a second portion of the electron beam incident on the workplace surface has a second beam dose that is not above a threshold value, and where a portion of the workplace surface upon which the second portion of the electron beam is incident is not passivated.

Assignees

• Fei Co

Inventors

• Bishop James
• Tran Toan Trong
• Aharonovich Igor
• Lobo Charlene
• Toth Milos

Classifications

• H01J2237/31796

  affecting resists · CPC title

• C23C16/047

  using irradiation by energy or particles · CPC title

• C23C16/0227 Primary

  by cleaning or etching · CPC title

• H01J37/3174

  Particle-beam lithography, e.g. electron beam lithography · CPC title

• C23C16/487 Primary

  using electron radiation · CPC title