Method for manufacturing light-emitting device

Patent metadata

Field	Value
Publication number	US-10510992-B2
Application number	US-201815922288-A
Country	US
Kind code	B2
Filing date	Mar 15, 2018
Priority date	May 4, 2012
Publication date	Dec 17, 2019
Grant date	Dec 17, 2019

Abstract

A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal.

First claim

What is claimed is:

1. A method for manufacturing a light-emitting device, comprising:
providing first and second electrodes over a substrate;
providing a first organic layer over the first electrode and a second organic layer over the second electrode;
providing a third electrode over the second organic layer to form a light-emitting element comprising the second and third electrodes, and the second organic layer;
providing a support over the first electrode and the light-emitting element with a resin layer therebetween;
making a cut overlapping with the first electrode in at least the support;
partly removing the resin layer by using the cut to form an opening overlapping with the first electrode; and
removing the first organic layer remaining on the first electrode after foaming the opening,
wherein the first and second organic layers each contain a light-emitting substance.

2. The method according to claim 1 , wherein the first and second organic layers are in contact with the first and second electrodes, respectively.

3. The method according to claim 1 , wherein the resin layer includes at least one of a light curable adhesive, a reactive curable adhesive, a heat curable adhesive, and an anaerobic adhesive.

4. The method according to claim 1 , wherein the substrate is flexible.

5. The method according to claim 1 , wherein the support is flexible.

6. The method according to claim 1 , further comprising:
forming a conductive layer in the opening to be in contact with the first electrode.

7. The method according to claim 1 , wherein the step of removing the first organic layer remaining on the first electrode is performed using an organic solvent.

8. The method according to claim 1 , wherein the first and second organic layers contain the same light-emitting substance.

9. A method for manufacturing a light-emitting device, comprising:
providing a transistor and a first electrode over a substrate;
providing a second electrode electrically connected to the transistor over the transistor with an insulating layer therebetween;
providing a first organic layer over the first electrode and a second organic layer over the second electrode;
providing a third electrode over the second organic layer to form a light-emitting element comprising the second and third electrodes, and the second organic layer;
providing a support over the first electrode and the light-emitting element with a resin layer therebetween;
making a cut overlapping with the first electrode in at least the support;
partly removing the resin layer by using the cut to form an opening overlapping with the first electrode; and
removing the first organic layer remaining on the first electrode after forming the opening,
wherein the first and second organic layers each contain a light-emitting substance.

10. The method according to claim 9 , wherein the transistor comprises an oxide semiconductor layer.

11. The method according to claim 9 , wherein the first and second organic layers are in contact with the first and second electrodes, respectively.

12. The method according to claim 9 , wherein the resin layer includes at least one of a light curable adhesive, a reactive curable adhesive, a heat curable adhesive, and an anaerobic adhesive.

13. The method according to claim 9 , wherein the substrate is flexible.

14. The method according to claim 9 , wherein the support is flexible.

15. The method according to claim 9 , further comprising:
forming a conductive layer in the opening to be in contact with the first electrode.

16. The method according to claim 9 , wherein the step of removing the first organic layer remaining on the first electrode is performed using an organic solvent.

17. The method according to claim 9 , wherein the first and second organic layers contain the same light-emitting substance.

18. The method according to claim 9 , wherein the insulating layer includes a polyimide resin.

Assignees

• Semiconductor Energy Lab

Inventors

• Chida Akihiro
• Hatano Kaoru
• Aoyama Tomoya
• Komatsu Ryu
• Kataniwa Masatoshi

Classifications

• H01L27/3276

  Electricity · mapped topic

• H01L51/5253

  Electricity · mapped topic

• H01L2251/5338

  Electricity · mapped topic

• H01L51/5203

  Electricity · mapped topic

• H01L2227/323

  Electricity · mapped topic