Method for manufacturing light-emitting device

Patent metadata

Field	Value
Publication number	US-9331310-B2
Application number	US-201313871248-A
Country	US
Kind code	B2
Filing date	Apr 26, 2013
Priority date	May 4, 2012
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal.

First claim

What is claimed is:

1. A method for manufacturing a light-emitting device, comprising the steps of:
forming an electrode terminal over a substrate;
forming a first electrode layer electrically connected to the electrode terminal;
forming a partition wall covering an edge portion of the first electrode layer;
forming an island-shaped organic compound-containing layer over and in contact with the electrode terminal and an organic compound-containing layer over and in contact with the first electrode layer;
forming a second electrode layer over the organic compound-containing layer;
forming a resin layer over the electrode terminal, the island-shaped organic compound-containing layer, the first electrode layer, the partition wall, the organic compound-containing layer and the second electrode layer;
forming an opening in the resin layer by making a cut surrounding a portion of the resin layer which overlaps with the electrode terminal and removing the portion of the resin layer surrounded by the cut and at least a portion of the island-shaped organic compound-containing layer which overlaps with the electrode terminal;
forming a conductive layer in the opening so as to be in contact with the electrode terminal; and
electrically connecting a flexible printed circuit to the conductive layer,
wherein the first electrode layer, the organic compound-containing layer and the second electrode layer form a light-emitting element, and
wherein the island-shaped organic compound-containing layer and the organic compound-containing layer contain a light-emitting substance.

2. The method for manufacturing a light-emitting device, according to claim 1 , wherein the substrate is a flexible substrate.

3. The method for manufacturing a light-emitting device, according to claim 1 , further comprising a step of forming a transistor over the substrate,
wherein the transistor is electrically connected to the first electrode layer, and
wherein the transistor comprises an oxide semiconductor layer.

4. The method for manufacturing a light-emitting device, according to claim 1 , wherein the organic compound-containing layer emits white light.

5. An electronic device comprising the light-emitting device manufactured by the method according to claim 1 .

6. The method for manufacturing a light-emitting device, according to claim 1 ,
wherein the portion of the resin layer surrounded by the cut and the portion of the organic compound-containing layer which overlaps with the electrode terminal are removed by attaching an adhesive tape to the portion of the resin layer and then pull the adhesive tape.

7. The method for manufacturing a light-emitting device, according to claim 1 , further comprising the step of:
removing the island-shaped organic compound-containing layer remaining on the electrode terminal after forming the opening.

8. A method for manufacturing a light-emitting device, comprising the steps of:
forming a separation layer over a substrate;
forming an electrode terminal over the separation layer;
forming a first electrode layer electrically connected to the electrode terminal;
forming a partition wall covering an edge portion of the first electrode layer;
forming an island-shaped organic compound-containing layer over and in contact with the electrode terminal and an organic compound-containing layer over and in contact with the first electrode layer;
forming a second electrode layer over the organic compound-containing layer;
forming a first resin layer over the electrode terminal, the island-shaped organic compound-containing layer, the first electrode layer, the partition wall, the organic compound-containing layer and the second electrode layer;
separating the substrate along the separation layer and attaching a flexible substrate to a surface exposed by the separation with a second resin layer provided therebetween;
forming an opening in the first resin layer by making a cut surrounding a portion of the first resin layer which overlaps with the electrode terminal and removing the portion of the first resin layer surrounded by the cut and at least a portion of the island-shaped organic compound-containing layer which overlaps with the electrode terminal;
forming a conductive layer in the opening so as to be in contact with the electrode terminal; and
electrically connecting a flexible printed circuit to the conductive layer,
wherein the first electrode layer, the organic compound-containing layer and the second electrode layer form a light-emitting element, and
wherein the island-shaped organic compound-containing layer and the organic compound-containing layer contain a light-emitting substance.

9. The method for manufacturing a light-emitting device, according to claim 8 , further comprising a step of forming a transistor over the substrate,
wherein the transistor is electrically connected to the first electrode layer, and
wherein the transistor comprises an oxide semiconductor layer.

10. The method for manufacturing a light-emitting device, according to claim 8 , wherein the organic compound-containing layer emits white light.

11. An electronic device comprising the light-emitting device manufactured by the method according to claim 8 .

12. The method for manufacturing a light-emitting device, according to claim 8 ,
wherein the portion of the first resin layer surrounded by the cut and the portion of the organic compound-containing layer which overlaps with the electrode terminal are removed by attaching an adhesive tape to the portion of the first resin layer and then pull the adhesive tape.

13. The method for manufacturing a light-emitting device, according to claim 8 , further comprising the step of:
removing the island-shaped organic compound-containing layer remaining on the electrode terminal after forming the opening.

14. A method for manufacturing a light-emitting device, comprising the steps of:
forming a first separation layer over a first substrate;
forming an electrode terminal over the first separation layer;
forming a first electrode layer electrically connected to the electrode terminal;
forming a partition wall covering an edge portion of the first electrode layer;
forming an organic compound-containing layer over and in contact with the electrode terminal and the first electrode layer;
forming a second electrode layer over the organic compound-containing layer;
forming a second separation layer over a second substrate;
bonding the first substrate and the second substrate with a first resin layer provided therebetween so that the second separation layer and the second electrode layer face each other;
separating the first substrate along the first separation layer and attaching a first flexible substrate to a surface exposed by the separation with a second resin layer provided therebetween;
separating the second substrate along the second separation layer and attaching a second flexible substrate to a surface exposed by the separation with a third resin layer provided therebetween;
forming an opening in the second flexible substrate, the third resin layer, the first resin layer and the organic compound-containing layer by making a cut surrounding portions of the second flexible substrate and the third resin layer which overlap with the electrode terminal and removing the portions of the second flexible substrate and the third resin layer surrounded by the cut and portions of the first resin layer and the organic compound-containing layer which overlap with the electrode terminal;
forming a conductive layer in the opening so as to be in contact with the electrode terminal; a

Assignees

• Semiconductor Energy Lab

Inventors

• Chida Akihiro
• Hatano Kaoru
• Aoyama Tomoya
• Komatsu Ryu
• Kataniwa Masatoshi

Classifications

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K50/80

  Constructional details · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10D86/423 Primary

  comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO · CPC title