Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound

Patent metadata

Field	Value
Publication number	US-10497634-B2
Application number	US-201715600843-A
Country	US
Kind code	B2
Filing date	May 22, 2017
Priority date	May 20, 2016
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

In various embodiments, a chip package is provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.

First claim

What is claimed is:

1. A chip package, comprising:
a chip comprising a chip metal surface;
a metal contact structure electrically contacting the chip metal surface;
packaging material at least partially encapsulating the chip and the metal contact structure; and
a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure,
wherein the chemical compound is configured to increase an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, and
wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium, wherein the chemical compound comprises a first functional group bonded to the chip metal surface and/or to the metal contact structure, and a second functional group bonded to the packaging material, and wherein at least one of the first functional group and the second functional group comprises a cyanate and/or a cyanate derivative.

2. A chip package, comprising:
a chip comprising a chip metal surface;
a metal contact structure electrically contacting the chip metal surface;
packaging material at least partially encapsulating the chip and the metal contact structure; and
a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure,
wherein the chemical compound is configured to increase an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound,
wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium,
wherein the chemical compound comprises a first functional group bonded to the chip metal surface and/or to the metal contact structure, and a second functional group bonded to the packaging material, and
wherein at least one of the first functional group and/or the second functional group comprises a substituted siloxane, tetracyanoquinodimethane, tetracyanoethylene, Si-amine, Si-diamine, Si-triamine, Si-diethylentnamintetraacetat, Si-3-[2(dimethylamino)ethyl]indold and/or aminopropyloxirane.

3. A chip package, comprising:
a chip comprising a chip metal surface;
a metal contact structure electrically contacting the chip metal surface;
packaging material at least partially encapsulating the chip and the metal contact structure; and
a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure,
wherein the chemical compound is configured to increase an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound,
wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium, and
wherein the chemical compound comprises dicyclopentadiene, adamantane, urotropine, cyclodextrine and/or cryptandene.

4. The chip package of claim 1 ,
wherein the chemical compound comprises a bi-functional aromatic compound or a bi-functional multiaromatic compound.

5. The chip package of claim 1 ,
wherein the chemical compound is bonded to the chip metal surface, and
wherein a bonding product of the chemical compound and the metal of the chip metal surface has a two-dimensional configuration.

6. The chip package of claim 1 ,
wherein the chip metal surface and/or the metal contact structure comprises a noble metal.

7. A method of forming a chip package, comprising:
electrically contacting a metal contact structure to a chip metal surface of a chip;
arranging a chemical compound in physical contact with at least one of the metal contact structure and the chip metal surface, wherein the chemical compound is configured to improve an adhesion between the metal contact structure and a packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, and wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium; and
at least partially encapsulating the chip and the metal contact structure with packaging material, wherein the packaging material is in physical contact with the chemical compound,
wherein the chemical compound comprises a first functional group bonded to the chip metal surface and/or to the metal contact structure, and a second functional group bonded to the packaging material, and wherein at least one of the first functional group and the second functional group comprises a cyanate and/or a cyanate derivative.

8. The method of claim 7 ,
wherein the arranging the chemical compound is executed after the electrically contacting the metal surface of the chip and before the at least partially encapsulating the chip and the metal contact structure.

9. The method of claim 7 ,
wherein the chemical compound is distributed in the packaging material, and wherein the arranging the chemical compound is executed together with the at least partially encapsulating the chip and the metal contact structure.

10. A chip package, comprising:
a chip comprising a chip metal surface;
a metal contact structure electrically contacting the chip metal surface;
packaging material at least partially encapsulating the chip and the metal contact structure, the packaging material comprising:
a chemical compound physically contacting at least one of the chip metal surface and the metal contact structure,
wherein the chemical compound is configured to increase an adhesion of the packaging material to the metal contact structure and/or to the chip metal surface, as compared with an adhesion in an arrangement without the chemical compound,
wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium, or tellurium,
wherein the chemical compound comprises a first functional group bonded to the chip metal surface and/or to the metal contact structure, and a second functional group bonded to the packaging material, and
wherein at least one of the first functional group and/or the second functional group comprises a substituted siloxane, tetracyanoquinodimethane, tetracyanoethylene, Si-amine, Si-diamine, Si-triamine, Si-diethylentnamintetraacetat, Si-3-[2(dimethylamino)ethyl]indold, and/or aminopropyloxirane.

11. A chip package, comprising:
a chip comprising a chip metal surface;
a metal contact structure electrically contacting the chip metal surface;
packaging material at least partially encapsulating the chip and the metal contact structure, the packaging material comprising:
a chemical compound physically contacting at least one of the chip metal surface and the metal contact structure,
wherein the chemical compound is configured to increase an adhesion of the packaging material to the metal contact structure and/or to the chip metal surface, as compared with an adhesion in an arrangement without the chemical compound,
wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium, or tellurium, and
wherein the chemical compound comprises dicyclopentadiene, adamantane, urotropine, cyclodextrine, and/or cryptandene.

12. The chip package of claim 11 ,
wherein the metal contact structure compr

Assignees

• Infineon Technologies Ag

Inventors

• Koerner Heinrich
• Bauer Michael
• Engl Reimund
• Huettinger Michael
• Kanert Werner
• Mahler Joachim
• Ruehle Brigitte

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/40 Primary

  characterised by their materials · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title