Chip package, method of forming a chip package and method of forming an electrical contact
US-12033972-B2 · Jul 9, 2024 · US
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Huettinger Michael patents
Huettinger Michael is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Huettinger Michael |
| Total patents | 12 |
| First publication | Nov 23, 2017 |
| Latest publication | Jul 9, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
US-10978418-B2 · Apr 13, 2021 · US
Chip package, method of forming a chip package and method of forming an electrical contact
US-2021082861-A1 · Mar 18, 2021 · US
Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package
US-10672678-B2 · Jun 2, 2020 · US
Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
US-2020013749-A1 · Jan 9, 2020 · US
Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound
US-10497634-B2 · Dec 3, 2019 · US
Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
US-10461056-B2 · Oct 29, 2019 · US
Methods for forming a chip package
US-2019287875-A1 · Sep 19, 2019 · US
Chip package and method of forming a chip package
US-9941181-B2 · Apr 10, 2018 · US
Chip package, method of forming a chip package and method of forming an electrical contact
US-2017338169-A1 · Nov 23, 2017 · US
Recent patents
Latest publications not already listed above.
Chip package and method of forming a chip package
US-2017338164-A1 · Nov 23, 2017 · US
Chip package and method of forming a chip package
US-2017338165-A1 · Nov 23, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 12 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/00 | 12 |
| H10W72/536 | 12 |
| H10W90/756 | 12 |
| H10W72/5363 | 12 |
| H10W70/457 | 12 |