Chip package, method of forming a chip package and method of forming an electrical contact
US-12033972-B2 · Jul 9, 2024 · US
This page is not indexed by search engines while we improve data quality.
Kanert Werner patents
Kanert Werner is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kanert Werner |
| Total patents | 12 |
| First publication | Nov 23, 2017 |
| Latest publication | Jul 9, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
US-10978418-B2 · Apr 13, 2021 · US
Chip package, method of forming a chip package and method of forming an electrical contact
US-2021082861-A1 · Mar 18, 2021 · US
Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package
US-10672678-B2 · Jun 2, 2020 · US
Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
US-2020013749-A1 · Jan 9, 2020 · US
Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound
US-10497634-B2 · Dec 3, 2019 · US
Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
US-10461056-B2 · Oct 29, 2019 · US
Methods for forming a chip package
US-2019287875-A1 · Sep 19, 2019 · US
Chip package and method of forming a chip package
US-9941181-B2 · Apr 10, 2018 · US
Chip package, method of forming a chip package and method of forming an electrical contact
US-2017338169-A1 · Nov 23, 2017 · US
Recent patents
Latest publications not already listed above.
Chip package and method of forming a chip package
US-2017338164-A1 · Nov 23, 2017 · US
Chip package and method of forming a chip package
US-2017338165-A1 · Nov 23, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 12 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/00 | 12 |
| H10W72/536 | 12 |
| H10W90/756 | 12 |
| H10W72/5363 | 12 |
| H10W70/457 | 12 |