Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing

Patent metadata

Field	Value
Publication number	US-10497592-B2
Application number	US-201715640047-A
Country	US
Kind code	B2
Filing date	Jun 30, 2017
Priority date	Jan 29, 2016
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

Disclosed are methods of preparing a semiconductor substrate having a metal seed layer for a subsequent electroplating operation. In some embodiments, the methods may include contacting the surface of the semiconductor substrate with a plasma to treat the surface by reducing metal oxides thereon and thereafter measuring a post-plasma-contact color signal from said surface, the color signal having one or more color components. The methods may then further include estimating the extent of the oxide reduction due to the plasma treatment based on the post-plasma contact color signal. In some embodiments, estimating the extent of the oxide reduction due to the plasma treatment is done based on the b* component of the post-plasma contact color signal. Also disclosed are plasma treatment apparatuses which may implement the foregoing methods.

First claim

We claim:

1. A plasma treatment apparatus for reducing metal oxides present on the surface of a metal seed layer of a semiconductor substrate in preparation for a subsequent electroplating operation, the apparatus comprising:
a processing chamber having at least one processing station therein;
a substrate holder configured to hold a substrate at the processing station;
a plasma generator configured to generate a plasma within and/or provide it to the processing chamber;
a color sensor configured to measure a color signal from a substrate, the color signal having one or more color components; and
a controller having non-transitory computer-readable instructions for:
operating the plasma generator to generate a plasma within and/or provide it to the processing chamber so that the plasma contacts the surface of a substrate at the processing station to treat it by reducing metal oxides thereon;
operating the color sensor, after the plasma contacts the substrate surface, to measure a post-plasma-contact color signal from the surface, the color signal having one or more color components; and
estimating the extent of the oxide reduction due to the plasma treatment based on the post-plasma contact color signal.

2. The apparatus of claim 1 , wherein the color sensor is located and/or configured so as to measure the color signal from the substrate while the substrate is located at the processing station.

3. The apparatus of claim 1 , further comprising:
a load-lock configured to provide substrate access to the processing chamber; and

wherein the color sensor is located and/or configured so as to measure the color signal from the substrate while the substrate is located within the load-lock.

4. The apparatus of claim 1 , wherein the color sensor is configured to measure a color signal having a b* color component.

5. The apparatus of claim 4 , wherein estimating the extent of the oxide reduction due to the plasma treatment is done based on the b* component of the post-plasma contact color signal.

6. The apparatus of claim 1 , wherein estimating the extent of the oxide reduction due to the plasma treatment comprises:
comparing the post-plasma-contact color signal to one or more reference color signals.

7. The apparatus of claim 1 , wherein estimating the extent of the oxide reduction due to the plasma treatment comprises:
calculating one or more metrics, each of which is indicative of the difference between the post-plasma-contact color signal and a reference color signal from a set of one or more reference color signals.

8. The apparatus of claim 7 , wherein:
the color sensor is configured to measure a color signal having a b* color component, and
each metric is monotonically related to the absolute value of the difference between the b* component of the post-plasma-contact color signal and the b* component of a reference color signal.

9. The apparatus of claim 8 , wherein the comparing is done based on the b* component of the color signals.

10. The apparatus of claim 8 , wherein estimating the extent of the oxide reduction due to the plasma treatment comprises:
calculating a metric which is indicative of the difference between the pre- and post-plasma-contact color signals.

11. The apparatus of claim 10 , wherein the metric is monotonically related to the absolute value of the difference between the b* component of the pre- and post-plasma-contact color signals.

12. The apparatus of claim 10 , wherein the plasma generator is remote from the processing chamber.

13. The apparatus of claim 1 , wherein the controller has further non-transitory computer-readable instructions for:
operating the color sensor, before contacting with the plasma, to measure a pre-plasma-contact color signal from said surface, the color signal having one or more color components,

wherein estimating the extent of the oxide reduction due to the plasma treatment comprises:
comparing the pre- and post-plasma-contact color signals.

14. The apparatus of claim 1 , wherein the plasma generator is configured to generate hydrogen radicals with the plasma.

15. The apparatus of claim 1 , wherein the metal is copper.

16. The apparatus of claim 1 , wherein the metal is cobalt.

17. The apparatus of claim 1 , wherein the color sensor is configured to be located about 0.1-5″ from the substrate surface during the measuring of the post-plasma-contact color signal from the surface.

18. The apparatus of claim 17 , wherein the color sensor is configured to be located about 0.4-1″ from the substrate surface during the measuring of the post-plasma-contact color signal from the surface.

Assignees

• Lam Res Corp

Inventors

• Ranjan Manish
• Sweeney Cian
• Ghongadi Shantinath

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H10W20/0523

  by irradiating with ultraviolet or particle radiation · CPC title