Polishing method and apparatus

Patent metadata

Field	Value
Publication number	US-10478938-B2
Application number	US-201715434736-A
Country	US
Kind code	B2
Filing date	Feb 16, 2017
Priority date	Jan 25, 2013
Publication date	Nov 19, 2019
Grant date	Nov 19, 2019

Abstract

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

First claim

What is claimed is:

1. A polishing method for polishing a plurality of substrates, comprising:
polishing a surface of a first substrate by pressing the first substrate against a polishing pad on a polishing table by a top ring, said polishing being executed in accordance with a preset polishing recipe; and
cleaning the polishing pad for removing foreign matters on said polishing pad by ejecting a cleaning fluid onto said polishing pad;
determining whether the first substrate is a last substrate to be polished;
wherein, when the first substrate is the last substrate to be polished, said cleaning after the completion of said polishing recipe is continued for a predetermined time and is then terminated after the elapse of said predetermined time, and when the first substrate is not the last substrate to be polished said cleaning after the completion of said polishing recipe is terminated by detecting a position of a subsequent substrate to be polished which is undergoing a substrate transferring process in which the first substrate is removed from said top ring at a substrate transferring position whether it's the last substrate or not.

2. The polishing method according to claim 1 , wherein said cleaning is terminated by detecting the arrival of the subsequent substrate to be polished which is undergoing said substrate transferring process to said substrate transferring position.

3. The polishing method according to claim 1 , wherein a rotational speed of said polishing table is varied in said polishing and said cleaning.

4. The polishing method according to claim 3 , wherein the rotational speed of said polishing table at the time of said cleaning is higher than that at the time of said polishing.

Assignees

• Ebara Corp

Inventors

• Torikoshi Tsuneo

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P90/123

  by grinding or lapping · CPC title

• B24B37/013

  Devices or means for detecting lapping completion · CPC title

• B24B49/00

  Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence) · CPC title

• B24B37/04

  designed for working plane surfaces · CPC title