Hybrid soft-rigid electrical interconnection system
US-2024091528-A1 · Mar 21, 2024 · US
Laminate, conductive pattern, and method for producing laminate
US9380701B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9380701-B2 |
| Application number | US-201414775576-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2014 |
| Priority date | Mar 13, 2013 |
| Publication date | Jun 28, 2016 |
| Grant date | Jun 28, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.
First claim
Opening claim text (preview).
The invention claimed is: 1. A laminate having a structure in which at least a layer including a support, a first primer layer, a first conductive layer, an insulating layer, a second primer layer, and a second conductive layer are laminated, wherein the first conductive layer includes a first plating seed layer formed by coating a portion of or entirety of a surface of the first primer layer with a fluid containing a conductive substance that is a transition metal or a compound of…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
- H05K1/092Primary
Electricity · mapped topic
Electricity · mapped topic
Physics · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9380701B2 cover?
- Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer i…
- Who is the assignee on this patent?
- Dainippon Ink & Chemicals
- What technology area does this patent fall under?
- Primary CPC classification H05K1/092. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).