Copper particle dispersing solution and method for producing conductive film using same
US-2016346838-A1 · Dec 1, 2016 · US
Wiring substrate, semiconductor device, and method for manufacturing thereof
US9237657B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9237657-B2 |
| Application number | US-201213349821-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 13, 2012 |
| Priority date | Oct 28, 2003 |
| Publication date | Jan 12, 2016 |
| Grant date | Jan 12, 2016 |
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Abstract
Official abstract text for this publication.
The present invention provides a thin wiring pattern such as wiring formed by discharging a droplet. In the present invention, a porous (including microporous) substance is formed as a base film in forming pattern by using a droplet discharge method (also referred to as an ink-jetting method). One feature of a wiring substrate according to the present invention provides a porous film and a conductive layer thereon. One feature of a semiconductor device of the present invention provides a thin film transistor in which a gate electrode is formed by the conductive layer having the above-described structure.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for manufacturing a wiring substrate, comprising the steps of: forming a first conductive layer; forming an insulating layer over the first conductive layer; forming a porous film on the insulating layer; forming an opening in the insulating layer and the porous film; discharging a composition including a conductive material into the opening and over the porous film to form a second conductive layer to be on and in direct contact with the fi…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9237657B2 cover?
- The present invention provides a thin wiring pattern such as wiring formed by discharging a droplet. In the present invention, a porous (including microporous) substance is formed as a base film in forming pattern by using a droplet discharge method (also referred to as an ink-jetting method). One feature of a wiring substrate according to the present invention provides a porous film and a cond…
- Who is the assignee on this patent?
- Maekawa Shinji, Arai Yasuyuki, Semiconductor Energy Lab
- What technology area does this patent fall under?
- Primary CPC classification H05K3/1208. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).