Heat management system

Patent metadata

Field	Value
Publication number	US-10468331-B2
Application number	US-201815869700-A
Country	US
Kind code	B2
Filing date	Jan 12, 2018
Priority date	Jan 12, 2018
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

A heat management system may include a die package. The die package may include a housing. The housing may include a housing surface. The housing may include a housing inlet port. The housing inlet port may be in communication with the housing surface. The housing may include a housing outlet port. The housing outlet port may be in communication with the housing surface.
The heat management system may include a manifold. The manifold may be configured to couple with the housing. The manifold may include a manifold surface. The manifold surface may be configured to mate with the housing surface. The manifold may include a manifold inlet port. The manifold inlet port may be in communication with the manifold surface. The manifold may include a manifold outlet port. The manifold outlet port may be in communication with the manifold surface.

First claim

The claimed invention is:

1. A heat management system, comprising:
a die package including a housing, wherein the housing includes:
a housing surface,
a housing inlet port in communication with the housing surface, wherein the housing inlet port is configured to allow a fluid to flow within the housing inlet port,
a housing outlet port in communication with the housing surface, wherein:
the housing outlet port is configured to allow a fluid to flow within the housing outlet port, and the housing outlet port is in fluidic communication with the housing inlet port; and
a manifold configured to couple with the housing, the manifold including:
a manifold surface configured to mate with the housing surface, a manifold inlet port in communication with the manifold surface, wherein the manifold inlet port is configured to allow a fluid to flow within the manifold inlet port, and
a manifold outlet port in communication with the manifold surface, wherein the manifold outlet port is configured to allow a fluid to flow within the manifold outlet port.

2. The heat management system of claim 1 , wherein the manifold surface is in direct surface-to-surface contact with the housing surface, the manifold inlet port is in communication with the housing inlet port, and the manifold outlet port is in communication with the housing outlet port.

3. The heat management system of claim 1 , wherein the manifold is configured to allow for the manifold inlet port to be brought into communication with the housing inlet port simultaneously with the manifold outlet port being brought into communication with the housing outlet port.

4. The heat management system of claim 1 , further comprising a gasket material configured to be disposed between the manifold and the housing.

5. The heat management system of claim 4 , further comprising a first gasket recess surrounding the manifold inlet port and a second gasket recess surrounding the manifold outlet port, and wherein the gasket material is positioned within the first gasket recess and the second gasket recess.

6. The heat management system of claim 1 , wherein the housing surface is a planar surface.

7. The heat management system of claim 1 , further comprising a manifold lip configured to engage with a housing wall.

8. The heat management system of claim 1 , wherein the manifold and the housing are configured to allow the manifold to couple with the housing in a single orientation.

9. The heat management system of claim 1 , wherein the housing includes a plurality of channels configured to alter the flow of a fluid within the housing, and the plurality of channels are in communication with the housing inlet port and the housing outlet port.

10. The heat management system of claim 1 , wherein:
the manifold includes manifold coupling features,
the housing includes housing coupling features configured to correspond in arrangement to the manifold coupling features, and
the manifold coupling features and the housing coupling features are configured to facilitate the coupling of the manifold with the housing.

11. The heat management system of claim 10 , wherein:
the manifold coupling features include either a rail or groove,
the housing coupling features include the other of the rail or the groove, and
the rail and groove are configured to intermesh with each other to provide a coupling force between the manifold and the housing.

12. The heat management system of claim 1 , further comprising a retention mechanism, wherein:
the manifold is configured to be positioned between a retention mechanism and the housing,
the retention mechanism includes retainer coupling features,
the housing includes housing coupling features corresponding in arrangement to the retainer coupling features, and
the retainer coupling features and the housing coupling features are configured to facilitate the coupling of the retention mechanism with the housing, thereby coupling the manifold with the housing.

13. A heat management system, comprising:
a die package including a housing, wherein the housing includes:
a housing surface,
a housing inlet port in communication with the housing surface,
a housing outlet port in communication with the housing surface;
a manifold configured to couple with the housing, the manifold including:
a manifold surface configured to mate with the housing surface,
a manifold inlet port in communication with the manifold surface, and
a manifold outlet port in communication with the manifold surface;
a heat exchanger configured to dissipate heat; and
one or more fluid transport lines configured to establish communication between the manifold inlet port and the heat exchanger, and to establish communication between the manifold outlet port and the heat exchanger.

14. The heat management system of claim 13 , further comprising a semiconductor die coupled to the housing.

15. The heat management system of claim 13 , further comprising a motherboard configured to be in communication with a semiconductor die.

16. The heat management system of claim 15 , wherein:
the manifold includes manifold coupling features,
the motherboard includes motherboard coupling features corresponding in arrangement to the manifold coupling features, and
the manifold coupling features and the motherboard coupling features are configured to facilitate the coupling of the manifold with the housing.

17. The heat management system of claim 15 , further comprising a retention mechanism, wherein:
the manifold is configured to be positioned between the retention mechanism and the motherboard,
the retention mechanism includes retainer coupling features,
the motherboard includes motherboard coupling features corresponding in arrangement to the retainer coupling features, and
the retainer coupling features and the motherboard coupling features are configured to facilitate the coupling of the retention mechanism with the motherboard, thereby coupling the manifold with the housing.

18. The heat management system of claim 13 , wherein the manifold surface is in direct surface-to-surface contact with the housing surface, the manifold inlet port is in communication with the housing inlet port, and the manifold outlet port is in communication with the housing outlet port.

19. The heat management system of claim 13 , wherein the manifold is configured to allow for the manifold inlet port to be brought into communication with the housing inlet port simultaneously with the manifold outlet port being brought into communication with the housing outlet port.

20. A method for assembling an electronic system, comprising:
placing a first manifold including manifold coupling features proximate a first housing, the housing including housing coupling features corresponding in arrangement to the manifold coupling features;
aligning the first manifold coupling features with the housing coupling features;
coupling the first manifold with the first housing;
wherein the first manifold includes:
a manifold surface configured to mate with the housing surface,
a manifold inlet port in communication with the manifold surface, wherein the manifold inlet port is configured to allow a fluid to flow within the manifold inlet port, and
a manifold outlet port in communication with the manifold surface, wherein the manifold outlet port is configured to allow a fluid to flow within the manifold outlet port; and
wherein the housing includes:
a housing surface,
a housing inlet port in communication with the ho

Assignees

• Intel Corp

Inventors

• Chang Je-Young
• Kim Jae W
• Mahajan Ravindranath V
• Rogers Blake
• Kulkarni Devdatta

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title