Technologies for dynamic cooling in a multi-chip package with programmable impingement valves
US-12035507-B2 · Jul 9, 2024 · US
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Kulkarni Devdatta patents
Kulkarni Devdatta is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kulkarni Devdatta |
| Total patents | 9 |
| First publication | Mar 29, 2018 |
| Latest publication | Jul 9, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Immersion cooling for integrated circuit devices
US-2023253288-A1 · Aug 10, 2023 · US
Immersion cooling for integrated circuit devices
US-2023125822-A1 · Apr 27, 2023 · US
Cold plates and liquid cooling systems for electronic devices
US-2023025921-A1 · Jan 26, 2023 · US
Technologies for dynamic cooling in a multi-chip package with programmable impingement valves
US-2022240417-A1 · Jul 28, 2022 · US
Technologies for dynamic cooling in a multi-chip package with programmable impingement valves
US-2022015262-A1 · Jan 13, 2022 · US
Fluid routing devices and methods for cooling integrated circuit packages
US-10770372-B2 · Sep 8, 2020 · US
Heat management system
US-10468331-B2 · Nov 5, 2019 · US
Fluid Routing Devices And Methods For Cooling Integrated Circuit Packages
US-2018090417-A1 · Mar 29, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 7 |
| Altera Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/00 | 5 |
| G06F1/20 | 5 |
| H10W90/00 | 4 |
| H05K7/20254 | 4 |
| H01L23/34 | 4 |