Reactive sputtering process

US10458015B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10458015-B2
Application numberUS-201214362758-A
CountryUS
Kind codeB2
Filing dateNov 23, 2012
Priority dateDec 5, 2011
Publication dateOct 29, 2019
Grant dateOct 29, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Reactive sputtering in which, by ion bombardment, material is ejected from the surface of a target and transitions to the gas phase. Negative voltage pulses are applied to the target to establish electric current having a current density greater than 0.5 A/cm2 at the target surface, such that the material transitioning to the gas phase is ionized. Reactive gas flow is established and reacts with the material of the target surface. Voltage pulse duration is such that, during the pulse, the target surface where the current flows is at least partly covered most of the time with a compound composed of reactive gas and target material and, consequently, the target surface is in a first intermediate state, and this covering is smaller at the end of the voltage pulse than at the start and, consequently, the target surface is in a second intermediate state at the end of the voltage pulse.

First claim

Opening claim text (preview).

What is claimed is: 1. Method for reactive sputtering in which, by means of ion bombardment, material is ejected from the surface of a first target and undergoes transition to a gas phase, wherein negative voltage is applied pulse-wise to the first target to generate a voltage pulse in such a way that an electric current having a current density of greater than 0.5 A/cm 2 occurs at a first target surface of the first target, such that the material undergoing transition to the gas phase is at least partly ionized, and in which a reactive gas flow is established and reactive gas reacts with the material of the first target surface, wherein a duration of the voltage pulse is chosen such that, during the voltage pulse, the first target surface is in a first intermediate state at the start of the voltage pulse and, in a second intermediate state at the end of the voltage pulse, wherein the second intermediate state is more metallic and less poisoned than the first intermediate state, and wherein interruption times between a first impulse and a later impulse at the first target are chosen in such a way that in this time, the reactive gas reacts with the first target surface to a point that at a beginning of the later impulse, the first target surface in terms of coverage has essentially the same intermediate state as at a beginning of the first impulse and the later impulse is an impulse directly following the first impulse, in such a way that no further impulse occurs in-between the first impulse and the later impulse. 2. Method according to claim 1 , characterized in that the duration of the voltage pulse is between 500 μs and 100 ms. 3. Method according to claim 1 , characterized in that the second intermediate state is essentially the metallic state or not the metallic state of the first target surface. 4. Method according to claim 1 , wherein the duration of the voltage pulse is between 1 ms and 10 ms. 5. Method according to claim 1 , wherein the duration of the voltage pulse is between 1 ms and 5 ms. 6. Method according to claim 1 , wherein the negative voltage is supplied by a DC generator. 7. Method according to claim 1 , wherein the voltage pulse increases from a first discharge voltage when the first target surface is in the first intermediate state to a second discharge voltage that is higher than the first discharge voltage when the first target surface is in the second intermediate state that is less poisoned and more metallic than the first intermediate state. 8. Method according to claim 1 , wherein a second target is used and the voltage pulse is applied such that a power input is switched sequentially from the first target to the second target, so that during at least one such sequence, the power input supplied from a generator is not interrupted. 9. Method according to claim 1 , wherein, at a location or locations on the first target surface where the electric current flows, a compound composed of the reactive gas and the material at least partly covers the first target surface and the location or locations covered by the compound is smaller in the second intermediate state at the end of the voltage pulse than in the first intermediate state. 10. Method according to claim 1 , wherein power generated by the voltage pulse and the electric current is maintained at a constant value for the duration of the voltage pulse by adjusting the voltage and inversely adjusting the electric current.

Assignees

Inventors

Classifications

  • Means for avoiding target poisoning · CPC title

  • Pulsed operation, e.g. HIPIMS · CPC title

  • in transition mode · CPC title

  • using pulsed power to the target · CPC title

  • Variation of parameters during sputtering · CPC title

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What does patent US10458015B2 cover?
Reactive sputtering in which, by ion bombardment, material is ejected from the surface of a target and transitions to the gas phase. Negative voltage pulses are applied to the target to establish electric current having a current density greater than 0.5 A/cm2 at the target surface, such that the material transitioning to the gas phase is ionized. Reactive gas flow is established and reacts wit…
Who is the assignee on this patent?
Oerlikon Trading Ag, Oerlikon Surface Solutions Ag Pfaeffikon
What technology area does this patent fall under?
Primary CPC classification H01J37/3467. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 29 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).