Dissolved ozone removal unit, apparatus for treating substrate, method of removing dissolved ozone, and method of cleaning substrate

Patent metadata

Field	Value
Publication number	US-10453672-B2
Application number	US-201615297728-A
Country	US
Kind code	B2
Filing date	Oct 19, 2016
Priority date	Oct 27, 2015
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

Disclosed are a dissolved ozone removal unit that removes dissolved ozone from liquid, an apparatus for treating a substrate, a method of removing dissolved ozone, and a method of cleaning a substrate. The method of removing dissolved ozone in liquid includes supplying micro bubbles to the liquid, and allowing dissolved ozone to exit from the liquid by energy or radical ions that are generated while the micro bubbles are dissolved in the liquid.

First claim

What is claimed is:

1. A method of removing dissolved ozone from a treating solution for a semiconductor substrate, the method comprising:
treating a semiconductor substrate with a treating solution including dissolved ozone;
collecting the treating solution after the treating solution has treated the semiconductor substrate;
rotating a propeller to rotate a solution containing a gas to supply micro bubbles to a container containing the treating solution, which is different from the solution, where the micro bubbles become smaller in size and explode while moving up in the treating solution; and
providing an exhaust pressure to discharge ozone, which exits from the treating solution by radical ions that are generated as a result of energy generated from explosion of the micro bubbles in the treating solution.

2. The method of claim 1 , wherein the micro bubbles are supplied to a lower area of the container in the treating solution.

3. The method of claim 1 , wherein the gas includes oxygen.

4. The method of claim 1 , wherein the gas includes an inert gas.

5. The method of claim 3 , wherein the micro bubbles have an average size of at most 50 micrometers.

6. The method of claim 4 , wherein the solution is water, and the inert gas comprises nitrogen, argon, or helium gas.

Assignees

• Semes Co Ltd

Inventors

• Bang Byungsun
• YOUN Junhee
• Kwon Kilsung

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• C02F2103/346

  from semiconductor processing, e.g. waste water from polishing of wafers · CPC title

• C02F1/20

  by degassing, i.e. liberation of dissolved gases (degasification of liquids in general B01D19/00; arrangement of degassing apparatus in boiler feed supply F22D) · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title