Chip component and production method therefor

Patent metadata

Field	Value
Publication number	US-9583238-B2
Application number	US-201314431771-A
Country	US
Kind code	B2
Filing date	Aug 7, 2013
Priority date	Sep 27, 2012
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.

First claim

What is claimed is:

1. A chip part, comprising:
a substrate having a front surface and a side surface;
an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, the electrode being disposed selectively on a front surface side of the substrate;
an insulating film interposed between the electrode and the substrate; and
an element disposed on the front surface side of the substrate.

2. The chip part according to claim 1 , wherein
the substrate has a rectangular shape in a plan view thereof, and
the electrode is formed so as to cover the edge portion of the front surface on three sides of the rectangular shape.

3. The chip part according to claim 1 , further comprising:
a wiring film that is formed on the front surface of the substrate across an interval from the edge portion and is electrically connected to the electrode.

4. The chip part according to claim 3 , wherein with the wiring film, a peripheral edge portion facing the edge portion of the substrate covered by the electrode is selectively exposed and a peripheral edge portion other than the exposed portion is selectively covered by a resin film.

5. The chip part according to claim 4 , wherein the electrode is formed so as to project from a front surface of the resin film.

6. The chip part according to claim 5 , wherein the electrode includes a lead-out portion that is led out in a lateral direction along the front surface of the resin film to selectively cover the front surface.

7. The chip part according to claim 1 , wherein the electrode includes an Ni layer and an Au layer and the Au layer is exposed at a frontmost surface.

8. The chip part according to claim 7 , wherein the electrode further includes a Pd layer interposed between the Ni layer and the Au layer.

9. The chip part according to claim 1 , wherein
the chip part has another electrode provided across an interval from the electrode, and
the chip part is a chip resistor that includes a resistor body formed on the substrate and connected between the two electrodes.

10. The chip part according to claim 9 , further comprising:
a plurality of resistor bodies including the resistor body; and
a plurality of fuses provided on the substrate and disconnectably connecting each of the plurality of the resistor bodies to the electrodes.

11. The chip part according to claim 1 , wherein
the chip part has another electrode provided across an interval from the electrode, and
the element includes a capacitor element formed on the substrate and connected between the two electrodes.

12. The chip part according to claim 11 , further comprising:
a plurality of capacitor components including the capacitor element; and
a plurality of fuses provided on the substrate and disconnectably connecting each of the plurality of the capacitor components to the electrodes.

13. A circuit assembly comprising:
the chip part according to claim 1 ; and
a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.

14. The circuit assembly according to claim 13 , wherein the solder is formed to cover a front surface portion and a side surface portion of the electrode when viewed from a direction of a normal to the mounting surface.

15. An electronic device comprising:
the circuit assembly according to claim 13 ; and
a housing that houses the circuit assembly.

16. The chip part according to claim 1 , wherein the insulating film is partly exposed on the side surface of the substrate, a part of the side surface being covered with the electrode.

17. A production method for a chip part comprising:
a step of forming a groove of a predetermined depth from a front surface of a substrate in a boundary region of a plurality of chip part regions of the substrate to achieve separation into substrates according to each of the plurality of chip part regions;
a step of forming an insulating film on side surfaces of the groove to form the insulating film on side surfaces of the respective substrates;
a step of growing by plating an electrode material on the insulating film along the side surfaces of the groove from the front surfaces and via edge portions of the respective substrates to form electrodes integrally on the front surfaces and the side surfaces so as to cover the edge portions of the front surfaces of the respective substrates, the electrodes being disposed selectively on a front surface side of the respective substrates;
a step of grinding rear surfaces of the substrates until the groove is reached to split the substrates into the plurality of chip parts; and
a step of disposing an element on the front surface side of the respective substrate in each of the chip parts.

18. The production method for chip part according to claim 17 , wherein the step of growing the electrode material includes growing the electrode material by electroless plating.

19. The production method for chip part according to claim 17 , further comprising:
a step of forming a wiring film on the front surface of the substrate of each of the plurality of chip part regions, wherein
the step of forming the groove includes forming an interval between the edge portion of each substrate and the wiring film, and
the step of growing includes growing the electrode material from each wiring film by plating.

20. The production method for chip part according to claim 19 , further comprising:
a step of forming a resin film that covers the wiring film before the groove is formed; and
a step of selectively removing the resin film so as to expose a peripheral edge portion that is to face a region in the wiring film in which the groove is to be formed.

21. The production method for chip part according to claim 17 , wherein the groove is formed by etching.

Assignees

• Rohm Co Ltd

Inventors

• Kondo Yasuhiro
• Matsuura Katsuya

Classifications

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01C1/012 Primary

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title

• H01C7/003

  Thick film resistors · CPC title

• H01G4/008

  Selection of materials · CPC title

• H01G5/01

  Details · CPC title