Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same

Patent metadata

Field	Value
Publication number	US-10393646-B2
Application number	US-201815913857-A
Country	US
Kind code	B2
Filing date	Mar 6, 2018
Priority date	Mar 2, 2015
Publication date	Aug 27, 2019
Grant date	Aug 27, 2019

Abstract

A method includes providing a device under test, which includes a lower test layer and an upper test layer that is stacked on the lower test layer and includes an overhang protruding past an edge of the lower test layer by a predetermined length, fixing the lower test layer onto a mounting stage, and measuring adhesive force of an interlayer adhesive layer in a tensile mode by applying a load to a bottom surface of the overhang of the upper test layer in a first direction. An apparatus includes a mounting stage fixing the device under test, a load applying tip applying the load to the bottom surface of the overhang, a location adjuster adjusting a distance between the device under test and the load carrying tip, a load cell detecting a magnitude of the applied load, and a controller controlling the location adjuster and the load cell.

First claim

What is claimed is:

1. An apparatus for measuring an adhesive force of an interlayer adhesive layer for a stacked semiconductor device, wherein the stacked semiconductor device is a device under test comprising a lower test layer and an upper test layer stacked on the lower test layer, the upper test layer comprising an overhang that protrudes past an edge of the lower test layer by a predetermined length, the lower test layer and the upper test layer being bonded together by the interlayer adhesive layer, the apparatus comprising:
a mounting stage fixing the device under test;
a load applying tip applying a load to a bottom surface of the overhang in a first direction;
a location adjuster adjusting a distance between the device under test and the load applying tip to apply the load to the bottom surface of the overhang;
a load cell detecting a magnitude of the applied load; and
a controller controlling the location adjuster and the load cell.

2. The apparatus of claim 1 , wherein the load applying tip comprises a protruding portion, the protruding portion including a convexly curved surface that contacts the bottom surface of the overhang during the application of the load.

3. The apparatus of claim 2 , wherein at least a portion of the convexly curved surface contacts the bottom surface of the overhang along a line extending in a second direction, the second direction corresponding to a lengthwise direction of the overhang.

4. The apparatus of claim 1 , wherein the load applying tip comprises a support and a base, the base being mounted on the support,
wherein the base contacts the bottom surface of the overhang, and
wherein the base is configured to be tilted according to a tilt of the overhang.

5. The apparatus of claim 4 , wherein the base is tilted around an axis of rotation in a third direction perpendicular to the first and second directions, the third direction corresponding to a propagation direction of crack in the interlayer adhesive layer.

6. The apparatus of claim 4 , wherein the load applying tip comprises:
a tilt supporting portion disposed between the support and the base and separating the support and the base from each other; and
a trench accommodating the tilt supporting portion and allowing the tilt supporting portion to rotate about an axis of rotation to tilt the base, the trench being provided on either the support or the base.

7. The apparatus of claim 6 , wherein a cross-section of the tilt supporting portion has an arc shape or a circular shape with a first curvature, the cross-section being perpendicular to a third direction, the third direction being perpendicular to the first and second directions and corresponding to a widthwise direction of the overhang, and
wherein the trench has a second curvature identical to the first curvature of the tilt supporting portion.

8. The apparatus of claim 6 , wherein the tilt supporting portion and the trench extend in a third direction, the third direction being perpendicular to the first and second directions and corresponding to a widthwise direction of the overhang.

9. The apparatus of claim 1 , wherein the controller calculates an energy release rate according to a crack propagation at a first bonding interface of the interlayer adhesive layer and the upper test layer, a second bonding interface of the interlayer adhesive layer and the lower test layer, or both.

Assignees

• Sk Hynix Inc
• Industry Academic Cooperation Foundation Yeungnam Univ

Inventors

• Shin Dong Kil
• Yoon Chul Keun
• Kang Min Kyu
• Lee Gyu Jei

Classifications

• H10W90/752

  between stacked chips · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• G01N19/04 Primary

  Measuring adhesive force between materials, e.g. of sealing tape, of coating · CPC title