Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same
US-10393646-B2 · Aug 27, 2019 · US
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Industry Academic Cooperation Foundation Yeungnam Univ patents
Industry Academic Cooperation Foundation Yeungnam Univ holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Apr 17, 2018 |
| Latest publication | Aug 27, 2019 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same
US-2018195951-A1 · Jul 12, 2018 · US
Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same
US-9945772-B2 · Apr 17, 2018 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same
US-10393646-B2 · Aug 27, 2019 · US
Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same
US-2018195951-A1 · Jul 12, 2018 · US
Method of measuring an adhesive force of interlayer adhesive layer in tensile mode for stacked semiconductor device and apparatus for measuring the same
US-9945772-B2 · Apr 17, 2018 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Physics | 3 |
| Electricity | 3 |