Wire sawing apparatus

Patent metadata

Field	Value
Publication number	US-10391673-B2
Application number	US-201615544234-A
Country	US
Kind code	B2
Filing date	Jan 7, 2016
Priority date	Jan 26, 2015
Publication date	Aug 27, 2019
Grant date	Aug 27, 2019

Abstract

A wire sawing apparatus of one embodiment comprises: a wire for cutting an ingot; an ingot conveyor unit for conveying the ingot to the wire; a nozzle for supplying slurry to the wire; and a dispersed slurry blocking unit disposed above the ingot sawed by the wire, so as to absorb at least a part of the slurry dispersed from the lateral sides of the ingot cut by the wire.

First claim

The invention claimed is:

1. A wire sawing apparatus, comprising:
a wire configured to cut an ingot;
an ingot conveyor unit configured to convey the ingot to the wire;
a nozzle configured to supply slurry to the wire; and
a dispersed slurry blocking unit disposed above and beside the ingot that is sawn by the wire and configured to absorb at least some of the slurry dispersed from a lateral surface of the ingot to be cut by the wire, the dispersed slurry blocking unit including a mesh structure that absorbs the dispersed slurry.

2. The wire sawing apparatus according to claim 1 , wherein the dispersed slurry blocking unit comprises:
an upper portion attached to a support surface that supports the ingot conveyor unit; and
an integrated portion including at least one mesh plate configured to absorb the dispersed slurry, the integrated portion being shaped so as to be attachable to or detachable from the upper portion.

3. The wire sawing apparatus according to claim 1 , wherein the dispersed slurry blocking unit comprises:
an upper portion attached to a support surface that supports the ingot conveyor unit;
a lower portion including at least one mesh plate configured to absorb the dispersed slurry; and
a lateral portion between the upper portion and the lower portion.

4. The wire sawing apparatus according to claim 3 , wherein the upper portion and the lateral portion are screwed together, and the lower portion and the lateral portion are integrated.

5. The wire sawing apparatus according to claim 3 , wherein the dispersed slurry blocking unit includes a slurry accommodation space defined by the upper portion, the lateral portion, and the lower portion and configured to store the dispersed slurry therein, and
wherein an opening is to be provided between the lower portion of the dispersed slurry blocking unit and the ingot to be cut, the opening being configured to allow introduction of the dispersed slurry into the slurry accommodation space.

6. The wire sawing apparatus according to claim 5 , wherein the dispersed slurry blocking unit further includes an outlet port configured to discharge the dispersed slurry in the slurry accommodation space in a direction perpendicular to a direction in which the wire moves.

7. The wire sawing apparatus according to claim 3 , wherein the lower portion is disposed such that a distance between a bottom of the lower portion and a top of the ingot to be cut ranges from 1 cm to 2 cm.

8. The wire sawing apparatus according to claim 3 , wherein the at least one mesh plate includes a plurality of mesh plates stacked one above another, the plurality of mesh plates including a first mesh plate, a second mesh plate stacked on the first mesh plate and a third mesh plate stacked on the second mesh plate, the first mesh plate being closer to the wire than the second mesh plate, the second mesh plate being closer to the wire than the third mesh plate, and
wherein a size of openings in the first mesh plate is less than a size of openings in the second mesh plate, and the size of openings in the second mesh plate is less than a size of openings in the third mesh plate.

9. The wire sawing apparatus according to claim 8 , where the mesh plates are stacked one above another in a direction in which the ingot conveyer unit conveys the ingot to the wire.

10. The wire sawing apparatus according to claim 8 , wherein a total number of the openings in the first mesh plate is less than a total number of the openings in the second mesh plate, and the total number of the openings in the second mesh plate is less than a total number of the openings in the third mesh plate.

11. The wire sawing apparatus according to claim 3 , wherein the upper portion of the dispersed slurry blocking unit is fixed to the support surface, and
wherein at least one of the lateral portion or the lower portion of the dispersed slurry blocking unit is shaped to be attachable to or detachable from the upper portion.

12. The wire sawing apparatus according to claim 3 , wherein the lower portion of the dispersed slurry blocking unit is disposed such that the lower portion is to be inclined toward the ingot to be cut.

13. The wire sawing apparatus according to claim 12 , wherein the lower portion has an inclination angle ranging from 7° to 10°.

14. The wire sawing apparatus according to claim 3 , wherein the upper portion and the lateral portion are screwed together, and
wherein the lower portion and the lateral portion are separated from each other and connected to each other by a connection member.

15. The wire sawing apparatus according to claim 1 , wherein a bottom of the dispersed slurry blocking unit is located higher than the wire.

16. The wire sawing apparatus according to claim 1 , wherein the dispersed slurry blocking unit is disposed at a region that the wire enters and another region that the wire exits.

17. The wire sawing apparatus according to claim 1 , wherein the dispersed slurry blocking unit is disposed such that the dispersed slurry blocking unit is to be parallel to the ingot to be cut in a longitudinal direction of the ingot to be cut.

18. The wire sawing apparatus according to claim 1 , wherein the ingot conveyor unit includes:
a feed table configured to lower the ingot toward the wire;
a holder configured to fix the ingot to the feed table; and
a beam element configured to connect the holder and the ingot to each other.

19. The wire sawing apparatus according to claim 1 , further comprising:
a wire roller having a groove configured to wind the wire and guide the wire;
a slurry tank configured to accommodate the slurry to be supplied to the nozzle;
a slurry bath configured to accommodate the slurry that has been outletted from the nozzle and used to saw the ingot;
a first bobbin configured to wind the wire that is used to saw the ingot;
a second bobbin configured to wind the wire that has sawn the ingot; and
at least one pulley configured to change a movement path of the wire.

Assignees

• Sk Siltron Co Ltd

Inventors

• Jeon Ji Won
• An Sang Min

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• B28D5/007 Primary

  Use, recovery or regeneration of abrasive mediums (for grinding and polishing in general B24B57/00) · CPC title

• B28D5/0076 Primary

  for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work · CPC title

• B28D5/045 Primary

  by cutting with wires or closed-loop blades (B28D5/042 takes precedence) · CPC title