Method of processing workpiece
US-2018286688-A1 · Oct 4, 2018 · US
Workpiece processing method
US2018286754A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2018286754-A1 |
| Application number | US-201815937402-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 27, 2018 |
| Priority date | Apr 4, 2017 |
| Publication date | Oct 4, 2018 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A processing method for processing a plate-shaped workpiece having a division line on the front side and a multilayer member containing metal formed on the back side is provided. The processing method includes a holding step of holding the front side of the workpiece on a holding table in the condition where the multilayer member formed on the back side of the workpiece is exposed, a cutting step of cutting the workpiece along the division line by using a cutting blade after performing the holding step, thereby forming a cut groove dividing the multilayer member, and a laser processing step of applying a laser beam to the workpiece along the cut groove after performing the cutting step. The cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.
First claim
Opening claim text (preview).
What is claimed is: 1 . A processing method for processing a plate-shaped workpiece having a division line on the front side and a multilayer member containing metal formed on the back side, said processing method comprising: a holding step of holding the front side of said workpiece on a holding table in the condition where said multilayer member formed on the back side of said workpiece is exposed; a cutting step of cutting said workpiece along said division line by using a cutting blade after performing said holding step, thereby forming a cut groove dividing said multilayer member; and a laser processing step of applying a laser beam to said workpiece along said cut groove after performing said cutting step; said cutting step including the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to said workpiece. 2 . The processing method according to claim 1 , wherein said laser processing step includes the step of applying a laser beam having an absorption wavelength to said workpiece along said cut groove to thereby fully cut said workpiece along said cut groove. 3 . The processing method according to claim 1 , wherein said laser processing step includes the step of applying a laser beam having a transmission wavelength to said workpiece along said cut groove to thereby form a modified layer inside said workpiece along said cut groove; said processing method further comprising a dividing step of dividing said workpiece along said modified layer after performing said laser processing step. 4 . The processing method according to claim 1 , wherein said laser beam is applied to the back side of said workpiece in said laser processing step; said processing method further comprising a sheet attaching step of attaching a sheet to the front side of said workpiece before performing said laser processing step.
Assignees
Inventors
Classifications
used to protect an active side of a device or wafer · CPC title
used during dicing or grinding · CPC title
Wafer tapes, e.g. grinding or dicing support tapes · CPC title
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
using incoherent radiation · CPC title
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Frequently asked questions
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- What does patent US2018286754A1 cover?
- A processing method for processing a plate-shaped workpiece having a division line on the front side and a multilayer member containing metal formed on the back side is provided. The processing method includes a holding step of holding the front side of the workpiece on a holding table in the condition where the multilayer member formed on the back side of the workpiece is exposed, a cutting st…
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P54/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Oct 04 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).