Apparatus and method for tuning a plasma profile using a tuning electrode in a processing chamber

Patent metadata

Field	Value
Publication number	US-10347465-B2
Application number	US-201815862851-A
Country	US
Kind code	B2
Filing date	Jan 5, 2018
Priority date	Mar 15, 2013
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

Embodiments of the present invention relate to apparatus for enhancing deposition rate and improving a plasma profile during plasma processing of a substrate. According to embodiments, the apparatus includes a tuning electrode disposed in a substrate support pedestal and electrically coupled to a variable capacitor. The capacitance is controlled to control the RF and resulting plasma coupling to the tuning electrode. The plasma profile and the resulting deposition rate and deposited film thickness across the substrate are correspondingly controlled by adjusting the capacitance and impedance at the tuning electrode.

First claim

The invention claimed is:

1. A method for processing a substrate within a processing apparatus, comprising:
powering a gas distribution manifold using an RF source while flowing one or more process gases into a chamber to form a plasma within a process volume of the chamber, the chamber having the substrate disposed on a substrate support pedestal therein;
receiving, from a sensor having a first terminal and a second terminal, a signal to adjust a capacitance of a tuning electrode, the tuning electrode disposed within the substrate support pedestal and electrically coupled to the first terminal of the sensor; and
controlling the plasma, based on the signal, by varying the capacitance of a variable capacitor having a first capacitor terminal electrically coupled to the second terminal of the sensor, wherein the processing apparatus further comprises:
a first inductor having a first L 1 terminal electrically coupled to a second terminal of the variable capacitor and a second L 1 terminal for electrical grounding; and
a second inductor having a first L 2 terminal electrically coupled to the second terminal of the sensor and a second L 2 terminal for electrical grounding, and wherein the second inductor is connected in parallel to the first inductor and the variable capacitor.

2. The method of claim 1 , further comprising controlling an impedance between the tuning electrode and ground by varying the capacitance of the variable capacitor electrically coupled to the tuning electrode.

3. The method of claim 2 , wherein the controlling the impedance between the tuning electrode and ground comprises tuning the impedance to a minimum value.

4. The method of claim 1 , further comprising controlling a current to the tuning electrode by varying the capacitance of the variable capacitor.

5. The method of claim 4 , wherein controlling the current to the tuning electrode comprises tuning the current to a maximum value.

6. The method of claim 1 , further comprising decreasing the plasma density at an edge of the substrate by increasing the capacitance of the variable capacitor.

7. The method of claim 1 , further comprising controlling an impedance of an RF path between the gas distribution manifold and the variable capacitor.

8. A method for processing a substrate within a processing apparatus, comprising:
powering a gas distribution manifold using an RF source while flowing one or more process gases into a chamber to form a plasma within a process volume of the chamber, the chamber having the substrate disposed on a substrate support pedestal therein;
receiving, from a sensor coupled to a tuning electrode, a signal to adjust a capacitance of the tuning electrode; and
varying, based on the signal, the capacitance of a variable capacitor coupled to the tuning electrode at a first terminal of the variable capacitor, the capacitance of the variable capacitor controlling the current to the tuning electrode, wherein the processing apparatus further comprises:
a first inductor having a first L 1 terminal electrically coupled to a second terminal of the variable capacitor and a second L 1 terminal for electrical grounding; and
a second inductor having a first L 2 terminal electrically coupled to the tuning electrode and a second L 2 terminal for electrical grounding, and wherein the second inductor is connected in parallel to the first inductor and the variable capacitor.

9. The method of claim 8 , further comprising controlling an impedance between the tuning electrode and ground by varying the capacitance of the variable capacitor.

10. The method of claim 9 , wherein the controlling the impedance between the tuning electrode and ground comprises tuning the impedance to a minimum value.

11. The method of claim 8 , further comprising decreasing a magnitude of an electric field at an edge of a substrate by increasing the capacitance of the variable capacitor.

12. The method of claim 11 , further comprising decreasing the plasma density at the edge of the substrate by increasing the capacitance of the variable capacitor.

13. The method of claim 8 , wherein controlling a current to the tuning electrode comprises tuning the current to a maximum value.

14. The method of claim 8 , further comprising controlling an impedance of an RF path between the gas distribution manifold and the tuning electrode.

Assignees

• Applied Materials Inc

Inventors

• Ayoub Mohamad A
• Chen Jian J
• Bansal Amit K

Classifications

• H01J37/32174 Primary

  Circuits specially adapted for controlling the RF discharge · CPC title

• H01J37/32935

  Monitoring and controlling tubes by information coming from the object and/or discharge · CPC title

• H01J37/32091

  the radio frequency energy being capacitively coupled to the plasma · CPC title

• C23C16/505

  using radio frequency discharges · CPC title

• H01J37/32715

  Workpiece holder · CPC title