Radio frequency match strap assembly
US-2024258072-A1 · Aug 1, 2024 · US
using radio frequency discharges
using radio frequency discharges · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C16/505 |
| Official title | using radio frequency discharges |
| Display label | using radio frequency discharges |
| Total patents | 2,165 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 122 |
| 2016 | 119 |
| 2017 | 118 |
| 2018 | 180 |
| 2019 | 174 |
| 2020 | 216 |
| 2021 | 184 |
| 2022 | 238 |
| 2023 | 249 |
| 2024 | 247 |
| 2025 | 264 |
| 2026 | 54 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Silicon precursors for silicon nitride deposition
US-11996286-B2 · May 28, 2024 · US
Hole Pattern For Uniform Illumination Of Workpiece Below A Capacitively Coupled Plasma Source
US-2015380221-A1 · Dec 31, 2015 · US
Chamber design for semiconductor processing
US-2015380217-A1 · Dec 31, 2015 · US
Capacitively coupled electrodeless plasma apparatus and a method using capacitively coupled electrodeless plasma for processing a silicon substrate
US-2015372167-A1 · Dec 24, 2015 · US
Apparatus and method of forming an indium gallium zinc oxide layer
US-9214340-B2 · Dec 15, 2015 · US
Defect control and stability of dc bias in rf plasma-based substrate processing systems using molecular reactive purge gas
US-2015354061-A1 · Dec 10, 2015 · US
Hollow cathode discharge (hcd) suppressing capacitively coupled plasma electrode and gas distribution faceplate
US-2015345020-A1 · Dec 3, 2015 · US
Multi-station plasma reactor with rf balancing
US-2015348854-A1 · Dec 3, 2015 · US
Electrode plate for plasma etching and plasma etching apparatus
US-2015348762-A1 · Dec 3, 2015 · US
Plasma processing method and apparatus
US-2015340208-A1 · Nov 26, 2015 · US
Plasma processing apparatus and method
US-2015340203-A1 · Nov 26, 2015 · US
Continuous plasma and RF bias to regulate damage in a substrate processing system
US-9194045-B2 · Nov 24, 2015 · US
Surface Treatment Apparatus
US-2015332893-A1 · Nov 19, 2015 · US
Pecvd deposition of smooth silicon films
US-2015325435-A1 · Nov 12, 2015 · US
Gas distribution showerhead for inductively coupled plasma etch reactor
US-2015318147-A1 · Nov 5, 2015 · US
Engine component
US-9175634-B2 · Nov 3, 2015 · US
Plasma-generating unit and substrate treatment apparatus including the same
US-2015311038-A1 · Oct 29, 2015 · US
Plasma enhanced chemical vapor deposition apparatus and method for controlling the same
US-9169561-B2 · Oct 27, 2015 · US
PECVD process
US-9157730-B2 · Oct 13, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C16/505?
- CPC C23C16/505 is the Cooperative Patent Classification code for “using radio frequency discharges.”
- How many patents are filed under CPC C23C16/505 (using radio frequency discharges)?
- Our database includes 2,165 publications tagged with this CPC code.
- Is patent activity under CPC C23C16/505 growing?
- Publication counts under this code: 247 in 2024 vs 264 in 2025 (latest complete years).