Common terminal heater for ceramic pedestals used in semiconductor fabrication

Patent metadata

Field	Value
Publication number	US-10345802-B2
Application number	US-201615046232-A
Country	US
Kind code	B2
Filing date	Feb 17, 2016
Priority date	Feb 17, 2016
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

System and methods for processing a substrate using a reactor with multiple heating zones and control of said heating zones using a common terminal shared between two power supplies are provided. The reactor includes a heater assembly for supporting the substrate and a showerhead for supplying process gases into the reactor. An inner heater and an outer heater are integrated in the heater assembly. An inner power supply has a positive terminal connected to a first end of the inner heater and a negative terminal is connected to a second end of the inner heater that is coupled to a common terminal. An outer power supply has a positive terminal connected to a first end of the outer heater and a negative terminal connected to a second end of the outer heater that is coupled to the common terminal. A common-terminal heater module is configured to receive a measured temperature that is proximate to the inner heater. A desired temperature setting is received and a servo control law is processed to identify a direct control setting of an inner voltage of the inner power supply and an open-loop control setting of an outer voltage for the outer power supply. The outer voltage is defined as a ratio of the inner voltage.

First claim

What is claimed is:

1. A system for processing a substrate, comprising,
a reactor including a heater assembly for supporting the substrate, the reactor is configured to receive process gases;
an inner heater integrated in the heater assembly;
an outer heater integrated in the heater assembly, the outer heater arranged to surround the inner heater so as to define distinct heater zones;
an inner power supply having a positive terminal connected to a first end of the inner heater and a negative terminal connected to a second end of the inner heater;
an outer power supply having a positive terminal connected to a first end of the outer heater and a negative terminal connected to a second end of the outer heater;
a common terminal connecting the second end of the inner heater to the second end of the outer heater using a wire that extends radially between an outer radius location of the outer heater and an inner radius location of the inner heater where the common terminal is disposed; and
a common-terminal heater module that receives a measured temperature from a region proximate to the inner heater, the common-terminal heater module receives a desired temperature setting and a servo control law is processed to identify a direct control setting of an inner voltage of the inner power supply and an open-loop control setting of an outer voltage for the outer power supply, wherein the outer voltage is defined as a ratio of the inner voltage, wherein the common-terminal heater module proportions the ratio to compensate for a difference in a length of a resistive element used to define the inner heater and a resistive element used to define the outer heater.

2. The system of claim 1 , wherein the servo control law processes a closed loop analysis of a difference between the desired temperature and the measured temperature from the inner heater.

3. The system of claim 2 , wherein the closed loop analysis is configured to iterate until the measured temperature is equal to the desired temperature; the closed loop analysis is configured to identify the inner voltage of the inner power supply that is used as the direct control setting.

4. The system of claim 1 , wherein the ratio is selected to cause the outer heater to approximately reach the desired temperature setting, such that approximate uniformity in temperature across the inner heater and outer heater is provided for processing the substrate when disposed over the heater assembly of the reactor.

5. The system of claim 1 , wherein a resistive value of each resistive element defining each of the inner and outer heaters changes as a function of temperature.

6. The system of claim 1 , wherein each of,
the negative terminal of the inner power supply,
the negative terminal of the outer power supply,
the second end of the inner heater; and
the second end of the outer heater,
are connected to a joining node of the common terminal.

7. The system of claim 6 , wherein the common terminal reduces connections from both the inner power supply and the outer power supply, such that the inner heater is a first heater zone and the outer heater is a second heater zone, wherein the common terminal reduces connections from n heater zones to n+1 connections.

8. The system of claim 6 , wherein the second end of the inner heater and the second end of the outer heater are electrically connected at the joining node of the common terminal.

9. The system of claim 1 , further comprising,
a temperature sensor disposed in the heater assembly proximate to the inner heater is used to obtain the measured temperature of the heater assembly in a vicinity of the inner heater, the heater assembly being defined from a ceramic material, said resistive elements of the inner heater and the outer heater are configured to change their resistive value as a function of temperature.

10. The system of claim 9 , wherein the common terminal is defined outside of the heater assembly, such that the inner heater and the outer heater are controlled by three connections made to the inner power supply and the outer power supply.

11. The system of claim 1 , wherein the proportion of the ratio further compensates for a difference in area of the heater assembly that includes the resistive element of the outer heater verses the resistive element of the inner heater.

12. The system of claim 1 , wherein the ratio is predefined to achieve a substantially uniform heat profile across a surface of the heater assembly, wherein the direct control setting of the inner voltage of the inner power supply is identified using a temperature sensor disposed in the heater assembly proximate to the inner heater to identify the measured temperature and no temperature sensor is used to measure temperature proximate to the outer heater.

13. The system of claim 1 , wherein the ratio is settable by a controller of the reactor, wherein specific settings of the ratio achieve differences in heat profiles of the heater assembly produced by the outer heater verses the inner heater, wherein the direct control setting of the inner voltage of the inner power supply is identified using a temperature sensor disposed in the heater assembly proximate to the inner heater to identify the measured temperature and no temperature sensor is used to measure temperature proximate to the outer heater.

14. The system of claim 1 , wherein the heater assembly is one of a pedestal or a showerhead of the reactor.

15. A method for controlling heater zones of a heater assembly used in a reactor implemented for processing substrates, comprising,
connecting a first terminal of a first power supply to a first end of an inner heater of the heater assembly;
connecting a first terminal of a second power supply to a first end of an outer heater of the heater assembly;
connecting a second end of the inner heater to a second end of the outer heater via a common terminal using a wire that extends radially between an outer radius location of the outer heater and an inner radius location of the inner heater where the common terminal is disposed;
connecting a second terminal of the first power supply and a second terminal of the second power supply to the common terminal, wherein the inner and outer heaters of the heater assembly are controlled with the first terminal of the first power supply, the first terminal of the second power supply, and the common terminal;
obtaining a measured temperature of the heater assembly proximate to the inner heater;
processing a servo control law to identify a direct control setting of an inner voltage of the first power supply so that a desired temperature matches the measured temperature; and
identifying an open-loop control setting of an outer voltage of the second power supply, the outer voltage being a multiple of the inner voltage, the multiple defined by a ratio, and
proportioning the ratio to compensate for a difference in a length of a resistive element used to define the inner heater and a resistive element used to define the outer heater.

16. The method of claim 15 , wherein connections to the heater assembly for the inner and outer heaters is limited to,
the first terminal of the first power supply,
the first terminal of the second power supply, and
the common terminal, wherein the common terminal is shared by the first and second power supplies.

17. The method of claim 15 , wherein processing the servo control law includes executing a closed loop analysis of a difference between the desired temperature and the measured temperature from the inner heater.

18. The meth

Assignees

• Lam Res Corp

Inventors

• Leeser Karl

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title