Component carrier

Patent metadata

Field	Value
Publication number	US-10315821-B2
Application number	US-201615352214-A
Country	US
Kind code	B2
Filing date	Nov 15, 2016
Priority date	Nov 15, 2016
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

One example discloses a component carrier, including: a cavity; wherein the cavity includes a set of cavity registration features configured to engage with a set of component registration features on a component; and wherein the cavity registration features are within the cavity.

First claim

What is claimed is:

1. A component carrier, comprising:
a cavity;
wherein the cavity includes a set of cavity registration features configured to engage with a set of component registration features on a component; and
wherein the cavity registration features are within the cavity and the cavity is a continuous cavity configured to engage with the component registration features of more than one component.

2. The carrier of claim 1 :
wherein the cavity includes a floor region; and
wherein the set of cavity registration features are included in the floor region.

3. The carrier of claim 1 :
wherein the set of cavity registration features are configured to position, orient or align a component within the cavity.

4. The carrier of claim 1 :
wherein the set of cavity registration features have at least one of: a variable pitch, or an aperiodic pitch.

5. The carrier of claim 1 :
wherein the set of cavity registration features each have a same geometric shape.

6. The carrier of claim 1 :
wherein the set of cavity registration features include a set of different geometric shapes.

7. The carrier of claim 1 :
wherein the set of cavity registration features include at least one of: a topography, a protrusion, a hemisphere, a rectangle, a ridge, a circle, a polygon, a pillar, an arc, an egg-tray, or an interlocking feature.

8. The carrier of claim 1 :
wherein the cavity is one of a set of separate or individual cavities configured to engage with the component registration features of more than one component.

9. The carrier of claim 1 :
wherein the set of cavity registration features are thermally formed or embossed onto the carrier substrate.

10. The carrier of claim 1 :
wherein the carrier substrate is at least one of: plastic, polyvinyl chloride, laminate, paper or metal.

11. The carrier of claim 1 :
wherein the component carrier is configured to carry at least one of: an Integrated Circuit (IC) package, a chip, a die, a passive electronic component, an active electronic component, a microcontroller, a microprocessor, a module, a MEMS device, or a MOEMS device, a non-electronic device, or a micro-fluidic device.

12. The carrier of claim 1 :
wherein the component carrier is wound on a reel configured to be used with a pick-and-place machine or an automatic component placement machine.

13. The carrier of claim 1 :
wherein the component carrier is configured as a shipping container.

14. The carrier of claim 1 :
wherein the cavity is configured to variably separate the more than one component.

15. The carrier of claim 14 :
wherein the set of separate cavities are separated by a set of barriers.

16. The carrier of claim 14 :
wherein the set of separate or individual cavities are configured to regularly separate the more than one component.

17. A method of manufacturing a component carrier, comprising:
forming a cavity in the component carrier; and
forming a set of cavity registration features within the cavity;
wherein the cavity registration features are configured to engage with a set of component registration features on a component and the cavity is a continuous cavity configured to engage with the component registration features of more than one component.

18. The method of claim 17 , further comprising:
forming a floor region in the cavity; and
forming the set of cavity registration features in the floor region.

Assignees

• Nxp Bv

Inventors

• Zaal Jeroen Johannes Maria
• Groenhuis Roelf Anco Jacob
• Van Gemert Leo
• Beelen-Hendrikx Caroline Catharina Maria

Classifications

• H10P72/7408

  the auxiliary support including alignment aids · CPC title

• H10P72/741

  the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title

• H10W76/17

  characterised by their materials · CPC title