Micro-element, alignment system and assembling method
US-2024404864-A1 · Dec 5, 2024 · US
the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip
the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/741 |
| Official title | {the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip} |
| Display label | the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip |
| Total patents | 282 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 8 |
| 2017 | 18 |
| 2018 | 28 |
| 2019 | 25 |
| 2020 | 30 |
| 2021 | 27 |
| 2022 | 46 |
| 2023 | 42 |
| 2024 | 24 |
| 2025 | 25 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and apparatus for stacking devices in an integrated circuit assembly
US-10163675-B2 · Dec 25, 2018 · US
Electronic apparatus
US-10157834-B1 · Dec 18, 2018 · US
Integrated circuit package and method of fabricating the same
US-10134685-B1 · Nov 20, 2018 · US
Receiving system for components
US-2018315628-A1 · Nov 1, 2018 · US
Device and method for self-adjustment of a component-handling device for electronic components
US-2018303015-A1 · Oct 18, 2018 · US
Carrier tape packaging method and apparatus
US-10101176-B2 · Oct 16, 2018 · US
Packing method for semiconductor device
US-10103036-B2 · Oct 16, 2018 · US
Method of manufacturing ultra thin wafers
US-2018294178-A1 · Oct 11, 2018 · US
Die carrier device and method
US-2018286733-A1 · Oct 4, 2018 · US
Surface mount package for semiconductor devices with embedded heat spreaders
US-10079160-B1 · Sep 18, 2018 · US
Film formation apparatus
US-2018163295-A1 · Jun 14, 2018 · US
Thermoplastic elastomer (tpe) adhesive carrier tape
US-2018166313-A1 · Jun 14, 2018 · US
Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removal
US-9991149-B2 · Jun 5, 2018 · US
Carrier tape
US-9984914-B2 · May 29, 2018 · US
Component carrier
US-2018134473-A1 · May 17, 2018 · US
Vented carrier tape
US-9969541-B2 · May 15, 2018 · US
Method and Apparatus for Stacking Devices in an Integrated Circuit Assembly
US-2018130691-A1 · May 10, 2018 · US
Process for transferring layers
US-9953855-B2 · Apr 24, 2018 · US
Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
US-2018108628-A1 · Apr 19, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/741?
- CPC H10P72/741 is the Cooperative Patent Classification code for “the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip.”
- How many patents are filed under CPC H10P72/741 (the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip)?
- Our database includes 282 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/741 growing?
- Publication counts under this code: 24 in 2024 vs 25 in 2025 (latest complete years).