Micro-element, alignment system and assembling method
US-2024404864-A1 · Dec 5, 2024 · US
the auxiliary support including alignment aids
the auxiliary support including alignment aids · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/7408 |
| Official title | {the auxiliary support including alignment aids} |
| Display label | the auxiliary support including alignment aids |
| Total patents | 310 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 4 |
| 2017 | 6 |
| 2018 | 8 |
| 2019 | 26 |
| 2020 | 34 |
| 2021 | 35 |
| 2022 | 53 |
| 2023 | 47 |
| 2024 | 37 |
| 2025 | 50 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing substrate with chips, and substrate processing device
US-2024079403-A1 · Mar 7, 2024 · US
Element chip manufacturing method
US-2020381367-A1 · Dec 3, 2020 · US
Method of singulate a package structure using a light transmitting film on a polymer layer
US-2020365420-A1 · Nov 19, 2020 · US
Dividing apparatus
US-2020335370-A1 · Oct 22, 2020 · US
Patterned carrier wafers and methods of making and using the same
US-10811298-B2 · Oct 20, 2020 · US
Method of transferring different types of micro devices
US-10790246-B1 · Sep 29, 2020 · US
Semiconductor packages with thin die and related methods
US-2020286735-A1 · Sep 10, 2020 · US
Substrate treatment apparatus
US-2020171626-A1 · Jun 4, 2020 · US
Chip handling and electronic component integration
US-10658182-B2 · May 19, 2020 · US
Micro Device Arrangement in Donor Substrate
US-2020083083-A1 · Mar 12, 2020 · US
Processing of plastics film components for display and/or sensor devices
US-2020066567-A1 · Feb 27, 2020 · US
Substrate processing carrier
US-2020051877-A1 · Feb 13, 2020 · US
Micro device arrangement in donor substrate
US-10535546-B2 · Jan 14, 2020 · US
Micro-LED Transfer Methods Using Light-Based Debonding
US-2019393069-A1 · Dec 26, 2019 · US
Chip handling and electronic component integration
US-2019378719-A1 · Dec 12, 2019 · US
Chip handling and electronic component integration
US-2019378720-A1 · Dec 12, 2019 · US
Element chip manufacturing method
US-2019371668-A1 · Dec 5, 2019 · US
Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging
US-10483177-B2 · Nov 19, 2019 · US
In-Situ Wafer Rotation for Carousel Processing Chambers
US-2019333783-A1 · Oct 31, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/7408?
- CPC H10P72/7408 is the Cooperative Patent Classification code for “the auxiliary support including alignment aids.”
- How many patents are filed under CPC H10P72/7408 (the auxiliary support including alignment aids)?
- Our database includes 310 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/7408 growing?
- Publication counts under this code: 37 in 2024 vs 50 in 2025 (latest complete years).