Thermally stable polyoxymethylene compositions

US10294361B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10294361-B2
Application numberUS-201415106079-A
CountryUS
Kind codeB2
Filing dateOct 21, 2014
Priority dateDec 19, 2013
Publication dateMay 21, 2019
Grant dateMay 21, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Polyoxymethylene compositions either consisting essentially of: polyoxymethylene polymer; at least pme amine polymer selected from the group consisting of polyacrylamides, polyallylamines, polyacrylic hydrazide, polymethacrylic hydrazide, polyaminoalkyl acrylate, polyaminoalkyl methacrylate, poly vinylalkylamine, and mixtures of these; and at least pme polyimide having a melting point that ranges between 20° C. below the melting point of (a) to 20° C. above the melting point of the polyoxymethylene polymer.

First claim

Opening claim text (preview).

What is claimed is: 1. A polyoxymethylene composition consisting essentially of: (a) 95.85 to 99.94 weight percent polyoxymethylene polymer, (b) 0.4 to 0.6 weight percent of an amine polymer selected from the group consisting of polyacrylamides, polyallylamines, polyacrylic hydrazide, polymethacrylic hydrazide, polyaminoalkyl acrylate, polyaminoalkyl methacrylate, poly vinylalkylamine, and mixtures of these; (c) 0.008 to 0.08 weight percent of a polyamide having a melting point of about 140° C. to about 240° C. and wherein said melting point ranges between 40° C. below the melting point of (a) to 40° C. above the melting point of (a), and (d) 0.01 to 4.0 weight percent of an antioxidant, wherein the polyoxymethylene composition, when molded, exhibits: a tensile creep to 10% strain at 90° C. and 25 MPa pressure of at least 0.32 minutes, as determined according to ASTM D2990; a time to mold deposit of at least 12 hours; and a thermally evolved formaldehyde of less than 0.50 percent, as measured at 250° C. for a period of 0.5 hours. 2. The polyoxymethylene composition of claim 1 , wherein (c) is an aliphatic polyamide. 3. The polyoxymethylene composition of claim 2 , wherein the aliphatic polyamide (c) is polyamide 66/610/6 terpolymer. 4. The polyoxymethylene composition of claim 1 , wherein (b) is selected from the group consisting of polyacrylamides, polyallylamines, polyvinylalkylamines, and mixtures of these. 5. The polyoxymethylene composition of claim 1 , wherein the antioxidant is a hindered phenolic antioxidant.

Assignees

Inventors

Classifications

  • Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

  • Homopolymers or copolymers of acrylamide or methacrylamide · CPC title

  • Stabilisers against oxidation, heat, light, ozone · CPC title

  • Phenols; Phenolates · CPC title

  • C08L59/02Primary

    Polyacetals containing polyoxymethylene sequences only · CPC title

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Frequently asked questions

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What does patent US10294361B2 cover?
Polyoxymethylene compositions either consisting essentially of: polyoxymethylene polymer; at least pme amine polymer selected from the group consisting of polyacrylamides, polyallylamines, polyacrylic hydrazide, polymethacrylic hydrazide, polyaminoalkyl acrylate, polyaminoalkyl methacrylate, poly vinylalkylamine, and mixtures of these; and at least pme polyimide having a melting point that rang…
Who is the assignee on this patent?
Du Pont
What technology area does this patent fall under?
Primary CPC classification C08L59/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 21 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).