Polyacetal Resin Composition and Molded Article Thereof

US2017145207A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017145207-A1
Application numberUS-201515300064-A
CountryUS
Kind codeA1
Filing dateMar 27, 2015
Priority dateMar 28, 2014
Publication dateMay 25, 2017
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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An object of the invention is to provide a resin composition, from which a molded article having high durability, sliding property and wear resistance can be produced with a high productivity. The present invention provides a polyacetal resin composition containing 100 parts by mass of a polyacetal resin (A) and 10 parts by mass or more and 100 parts by mass or less of a glass filler (B), in which when a molded article formed of the polyacetal resin composition by molding is fractured by application of tensile force, the surface of the glass filler (B) protruding from a fractured surface of a fractured molded article is covered with a component containing the polyacetal resin (A) having an average thickness of 0.2 μm or more and 3.0 μm or less.

First claim

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1 . A polyacetal resin composition containing 100 parts by mass of a polyacetal resin (A) and 10 parts by mass or more and 100 parts by mass or less of a glass filler (B) wherein, when a molded article formed of the polyacetal resin composition by molding is fractured by application of tensile force, the surface of the glass filler (B) protruding from a fractured surface of a fractured molded article is covered with a component containing the polyacetal resin (A) having an average thickness of 0.2 μm or more and 3.0 μm or less. 2 . A polyacetal resin composition containing 100 parts by mass of a polyacetal resin (A) and 10 parts by mass or more and 100 parts by mass or less of a glass filler (B) wherein, a tensile fracture stress of a molded article obtained by molding the polyacetal resin composition and measured in accordance with ISO527-1 is 135 MPa or more; a bending elastic modulus of the molded article measured in accordance with ISO178 is 7500 MPa or more; and a value of (tensile fracture stress—65)(MPa)/glass filler ratio (mass %) is 2.90 or more. 3 . The polyacetal resin composition according to claim 2 , wherein when the molded article formed of the polyacetal resin composition by molding is fractured by application of tensile force, the surface of the glass filler (B) protruding from a fractured surface of a fractured molded article is covered with a component containing the polyacetal resin (A) having an average thickness of 0.2 μm or more and 3.0 μm or less. 4 . The polyacetal resin composition according to claim 1 , further containing a polyethylene resin (C) having a weight-average molecular weight of 500,000 or less in an amount of 0.5 parts by mass or more and 8 parts by mass or less based on 100 parts by mass of the polyacetal resin (A). 5 . The polyacetal resin composition according to claim 4 , wherein the polyethylene resin (C) having a weight-average molecular weight of 500,000 or less has a melting point of 115° C. or less. 6 . The polyacetal resin composition according to claim 1 , wherein at least one acid is contained as a material having a function of modifying the surface of the glass filler (B). 7 . The polyacetal resin composition according to claim 6 , wherein the acid is carboxylic acid. 8 . The polyacetal resin composition according to claim 1 , wherein the polyacetal resin (A) contains a block component. 9 . The polyacetal resin composition according to claim 8 , wherein the block component is a hydrogenated polybutadiene component. 10 . A molded article obtained by molding the polyacetal resin composition according to claim 1 . 11 . The molded article according to claim 10 , wherein a polyethylene resin (C) having a weight-average molecular weight of 500,000 or less is contained; an amount of the polyethylene resin (C) having a weight-average molecular weight of 500,000 or less in a surface layer of the molded article is larger than an amount of the polyethylene resin (C) having a weight-average molecular weight of 500,000 or less in a layer surface deeper than 1,000 μm from the surface layer of the molded article as measured by cutting out the layer. 12 . A method for preparing the polyacetal resin composition according to claim 1 , comprising a step of modifying a surface of the glass filler (B) with a substance containing at least one acid and having a function of modifying the surface of the glass filler (B), and a step of mixing the glass filler modified and the polyacetal resin (A). 13 . The polyacetal resin composition according to claim 2 , further containing a polyethylene resin (C) having a weight-average molecular weight of 500,000 or less in an amount of 0.5 parts by mass or more and 8 parts by mass or less based on 100 parts by mass of the polyacetal resin (A). 14 . The polyacetal resin composition according to claim 13 , wherein the polyethylene resin (C) having a weight-average molecular weight of 500,000 or less has a melting point of 115° C. or less. 15 . The polyacetal resin composition according to claim 2 , wherein at least one acid is contained as a material having a function of modifying the surface of the glass filler (B). 16 . The polyacetal resin composition according to claim 15 , wherein the acid is carboxylic acid. 17 . The polyacetal resin composition according to claim 2 , wherein the polyacetal resin (A) contains a block component. 18 . The polyacetal resin composition according to claim 17 , wherein the block component is a hydrogenated polybutadiene component. 19 . A molded article obtained by molding the polyacetal resin composition according to claim 2 . 20 . The molded article according to claim 19 , wherein a polyethylene resin (C) having a weight-average molecular weight of 500,000 or less is contained; an amount of the polyethylene resin (C) having a weight-average molecular weight of 500,000 or less in a surface layer of the molded article is larger than an amount of the polyethylene resin (C) having a weight-average molecular weight of 500,000 or less in a layer surface deeper than 1,000 μm from the surface layer of the molded article as measured by cutting out the layer. 21 . A method for preparing the polyacetal resin composition according to claim 2 , comprising a step of modifying a surface of the glass filler (B) with a substance containing at least one acid and having a function of modifying the surface of the glass filler (B), and a step of mixing the glass filler modified and the polyacetal resin (A). 22 . The polyacetal resin composition according to claim 4 , wherein at least one acid is contained as a material having a function of modifying the surface of the glass filler (B). 23 . The polyacetal resin composition according to claim 22 , wherein the polyacetal resin (A) contains a block component. 24 . The polyacetal resin composition according to claim 6 , wherein the polyacetal resin (A) contains a block component.

Assignees

Inventors

Classifications

  • C08L59/02Primary

    Polyacetals containing polyoxymethylene sequences only · CPC title

  • Ingredients agglomerated by treatment with a binding agent · CPC title

  • Glass · CPC title

  • Block or graft polymers not provided for in groups C08L1/00 - C08L85/04 · CPC title

  • Glass · CPC title

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What does patent US2017145207A1 cover?
An object of the invention is to provide a resin composition, from which a molded article having high durability, sliding property and wear resistance can be produced with a high productivity. The present invention provides a polyacetal resin composition containing 100 parts by mass of a polyacetal resin (A) and 10 parts by mass or more and 100 parts by mass or less of a glass filler (B),…
Who is the assignee on this patent?
Asahi Chemical Ind
What technology area does this patent fall under?
Primary CPC classification C08L59/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu May 25 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).