Integrated pressure and temperature sensor

Patent metadata

Field	Value
Publication number	US-10288513-B2
Application number	US-201615265225-A
Country	US
Kind code	B2
Filing date	Sep 14, 2016
Priority date	Sep 14, 2016
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process.

First claim

What is claimed is:

1. A combined temperature and pressure sensing device, comprising:
a single piece body, the single piece body comprising:
a cylindrical body portion defining a central axis;
a first cavity extending through the cylindrical body portion adjacent the central axis, the first cavity comprising:
a tubular orifice offset from the central axis and extending from an open proximal end of the tubular orifice to an enclosed distal end of the tubular orifice;

a lobe of the single piece body extending distally from the cylindrical body portion enclosing the distal end of the tubular orifice;
a second cavity extending through the cylindrical body portion from an open distal end of the second cavity to a proximal through-hole in the cylindrical body portion offset from the central axis, the second cavity comprising:
a second orifice extending from the open distal end of the second cavity toward the proximal through-hole and extending around the tubular orifice; and

a wall defining a boundary between the tubular orifice and the second orifice.

2. The device of claim 1 , wherein the wall includes a semi-circular geometry in a cross-section perpendicular to the central axis.

3. The device of claim 1 , comprising:
a temperature sensor carrier installed into the open proximal end of the tubular orifice, the temperature sensor carrier comprising:
a conductive proximal surface;
a temperature sensing element electrically coupled to the conductive proximal surface and installed in the enclosed distal end of the tubular orifice.

4. The device of claim 3 , comprising:
an electrically conductive member extending distally from the wire bondable proximal surface to a resistance weldable surface, the resistance weldable surface welded to a terminal of the temperature sensing element.

5. The device of claim 3 , wherein the conductive proximal surface comprises a wire bondable surface.

6. The device of claim 3 , wherein the temperature sensing element comprises a thermistor.

7. The device of claim 6 , wherein the thermistor comprises a negative temperature coefficient (NTC) thermistor.

8. The device of claim 3 , comprising a pressure sensing element hermetically sealed over the proximal through-hole.

9. The device of claim 3 , comprising a threaded portion on an external circumference of the cylindrical body portion.

10. The device of claim 3 , comprising a printed circuit board having one or more conductive pads wire-bonded to the conductive surface.

11. The device of claim 1 , wherein the second orifice has a semi-circular cross section.

12. The device of claim 1 , wherein the second orifice is tapered toward the through-hole.

13. The device of claim 1 , comprising a connector portion mechanically coupled to the cylindrical body portion.

Assignees

• Sensata Technologies Inc
• Sensata Tech

Inventors

• Bae Jun H
• Lal Nikhil B
• Li Guanshi
• Chen Shuo Robert
• Mcbrine Mark W

Classifications

• G01K1/08

  Protective devices, e.g. casings · CPC title

• G01D21/02 Primary

  Measuring two or more variables by means not covered by a single other subclass · CPC title

• G01L19/0092 Primary

  Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature (G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26) · CPC title

• G01L19/0038

  being part of the housing (other details about the housing G01L19/14) · CPC title

• G01L19/0084

  to the outside of the housing (other details about the housing see G01L19/14) · CPC title