Overmolded lead frame assembly for pressure sensing applications
US-10830656-B2 · Nov 10, 2020 · US
This page is not indexed by search engines while we improve data quality.
Bae Jun H patents
Bae Jun H is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bae Jun H |
| Total patents | 4 |
| First publication | Mar 15, 2018 |
| Latest publication | Nov 10, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Overmolded lead frame assembly for pressure sensing applications
US-2019368958-A1 · Dec 5, 2019 · US
Integrated pressure and temperature sensor
US-10288513-B2 · May 14, 2019 · US
Integrated pressure and temperature sensor
US-2018073950-A1 · Mar 15, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Sensata Technologies Inc | 4 |
| Sensata Tech | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01L19/0084 | 4 |
| G01K1/08 | 2 |
| G01D21/02 | 2 |
| G01L19/0092 | 2 |
| G01L19/0038 | 2 |