Device for measuring a pressure and a temperature of a fluid medium flowing in a duct

Patent metadata

Field	Value
Publication number	US-9606010-B2
Application number	US-201414280027-A
Country	US
Kind code	B2
Filing date	May 16, 2014
Priority date	May 16, 2013
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A device for measuring a pressure and a temperature of a fluid medium flowing in a duct, the device including a pressure sensor element; a temperature sensor having a temperature sensor element; a housing that has a connecting piece, the connecting piece being insertable into the duct in an insertion direction, the connecting piece having an interior chamber, the interior chamber having an opening through which the interior chamber may be exposed to the fluid medium; and a carrier substrate, the pressure sensor element being connected electrically and mechanically to the carrier substrate. In order to increase the service life of the temperature sensor, and in order to allow temperature measurement that is as accurate as possible, it is provided, in this context, that the carrier substrate be positioned substantially parallel to the insertion direction in the interior chamber of the connecting piece, the interior chamber extending along the insertion direction, and it is provided that the temperature sensor be connected electrically and mechanically to the carrier substrate.

First claim

What is claimed is:

1. A device for measuring a pressure and a temperature of a fluid medium flowing in a duct, comprising:
a pressure sensor element;
a temperature sensor including a temperature sensor element;
a housing including a connecting piece that is insertable into the duct in an insertion direction, wherein:
the connecting piece includes an interior chamber, and
the interior chamber includes an opening through which the interior chamber may be exposed to the fluid medium; and

a carrier substrate, wherein:
the pressure sensor element is connected electrically and mechanically to the carrier substrate,
the carrier substrate is positioned substantially parallel to the insertion direction, in the interior chamber of the connecting piece,
the interior chamber extends along the insertion direction, and
the temperature sensor is connected electrically and mechanically to the carrier substrate.

2. The device as recited in claim 1 , wherein:
at an end of the connecting piece assigned to the fluid medium, the connecting piece includes a temperature measuring section that is contiguous to the interior chamber,
the temperature sensor element of the temperature sensor extends through the opening of the interior chamber into the temperature measuring section,
in the temperature measuring section, an outer wall on the connecting piece is configured with a plurality of wall openings in such a manner that the temperature sensor element of the temperature sensor may be exposed to the flowing fluid medium.

3. The device as recited in claim 1 , wherein the plurality of wall openings are each in the shape of a slot.

4. The device as recited in claim 1 , wherein in the interior chamber, the carrier substrate extends, at most, to the opening of the interior chamber.

5. The device as recited in claim 1 , wherein in the interior chamber of the connecting piece, the carrier substrate is fixed to an inner wall of the interior chamber with the aid of one of a force-locked and a continuous material connection.

6. The device as recited in claim 1 , wherein at least one of the pressure sensor element and the temperature sensor is covered by a passivating layer.

7. The device as recited in claim 6 , wherein the passivating layer includes a gel.

8. The device as recited in claim 1 , wherein:
the housing includes a male connector, and
the carrier substrate is plate-shaped and has a first carrier substrate end opposite to the male connector, and
the temperature sensor is attached to the first carrier substrate end.

9. The device as recited in claim 8 , wherein the temperature sensor element of the temperature sensor is positioned at the first carrier substrate end and is connected to the carrier substrate electrically and mechanically.

10. The device as recited in claim 3 , wherein the carrier substrate includes a carrier substrate opening between the pressure sensor element and the temperature sensor element.

11. The device as recited in claim 8 , wherein:
the male connector includes at least one plug contact,
the at least one plug contact is electrically contacted to the carrier substrate at a first end of the plug contact; and
the at least one plug contact is able to be electrically contacted with a mating connector at a second end of the plug contact.

12. The device as recited in claim 11 , wherein:
the carrier substrate includes a second carrier substrate end that faces away from the first carrier substrate end and has at least one connector element for electrical contacting, and
the at least one connector element is contacted with the first end of the plug contact, using at least one type of connection from the group: snap-in connection, clamping connection, insulation-displacement connection, spring element connection, and adhesive connection.

Assignees

• Bosch Gmbh Robert

Inventors

• Kaiser Ralf
• Lux Alexander
• Reinhard Markus
• Gmelin Christoph
• Herrmann Reinhold
• Patzner Patrick

Classifications

• G01L19/143

  Two part housings · CPC title

• G01K13/02 Primary

  for measuring temperature of moving fluids or granular materials capable of flow · CPC title

• G01L19/0092

  Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature (G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26) · CPC title

• G01K2205/02

  for measuring inlet gas temperature · CPC title

• G01L11/00

  Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00 · CPC title