Reduction of solder interconnect stress

Patent metadata

Field	Value
Publication number	US-10276534-B2
Application number	US-201715671955-A
Country	US
Kind code	B2
Filing date	Aug 8, 2017
Priority date	Aug 30, 2016
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A first electrical contact and second contact is upon an interposer and/or upon a processing device. The first contact includes a minor axis and a major axis. The second contact includes diameter axes. The first contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The first electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The first electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring first electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring first electrical contacts within the electrical contact grid may differ relative thereto.

First claim

What is claimed is:

1. An interposer comprising:
a matrix of contacts arranged in rows and columns, wherein the matrix of contacts comprise:
a plurality of first contacts each comprising a major axis and a minor axis, wherein a surface area of each of the plurality of first contacts decreases radially away from a center of the interposer; and
a plurality of second contacts each comprising diameter axes,
wherein the major axis of the plurality of first contacts are aligned with a direction of expansion of the interposer.

2. The interposer of claim 1 , wherein the plurality of first contacts are located within a power/ground region of the interposer and the plurality of second contacts are located within an input/output region of the interposer.

3. The interposer of claim 1 , wherein the plurality of first contacts are located within a quintain of the interposer and the plurality of second contacts are located within an perimeter region of the interposer that complexly surrounds the quintain.

4. The interposer of claim 1 , wherein the plurality of first contacts comprise a diagonal contact nearest the interposer center.

5. The interposer of claim 4 , wherein the first contacts within the same row as the diagonal contact are rotated relative to the diagonal contact.

6. The interposer of claim 4 , wherein the first contacts within the same column as the diagonal contact are rotated relative to the diagonal contact.

7. The interposer of claim 4 , wherein the first contacts within the same row as the diagonal contact have aspect ratios and wherein the first contacts within the same column as the diagonal contact have different aspect ratios.

8. A processing device comprising:
a matrix of contacts arranged in rows and columns, wherein the matrix of contacts comprise:
a plurality of first contacts each comprising a major axis and a minor axis, wherein a surface area of each of the plurality of first contacts decreases radially away from a center of the processing device; and
a plurality of second contacts each comprising diameter axes,
wherein the major axis of the plurality of first contacts are aligned with a direction of expansion of the processing device.

9. The processing device of claim 8 , wherein the plurality of first contacts are located within a power/ground region of the processing device and the plurality of second contacts are located within an input/output region of the processing device.

10. The processing device of claim 8 , wherein the plurality of first contacts are located within a quintain of the processing device and the plurality of second contacts are located within an perimeter region of the processing device that complexly surrounds the quintain.

11. The processing device of claim 8 , wherein the plurality of first contacts comprise a diagonal contact nearest the processing device center.

12. The processing device of claim 11 , wherein the first contacts within the same row as the diagonal contact are rotated relative to the diagonal contact.

13. The processing device of claim 11 , wherein the first contacts within the same column as the diagonal contact are rotated relative to the diagonal contact.

14. The processing device of claim 11 , wherein the first contacts within the same row as the diagonal contact have aspect ratios and wherein the first contacts within the same column as the diagonal contact have different aspect ratios.

Assignees

• IBM

Inventors

• Call Anson J
• Khanna Vijayeshwar D
• Russell David J
• Tunga Krishna R

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/248

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W20/43

  Layouts of interconnections · CPC title