Heating vaporization system and heating vaporization method

Patent metadata

Field	Value
Publication number	US-10240233-B2
Application number	US-201414290864-A
Country	US
Kind code	B2
Filing date	May 29, 2014
Priority date	May 30, 2013
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

A heating vaporization system provided with: a container that heats and vaporizes a source to produce source gas; a pipe for leading out the source gas; a sensor flow path that is provided in the pipe; a flow rate detecting part that is provided with a thermal type flow rate sensor provided in the sensor flow path, and measures a flow rate of the source gas flowing through the pipe; a flow rate regulating part that regulates the flow rate of the source gas flowing through the pipe located upstream of the flow rate detecting part; and a control part that uses a result of the detection by the flow rate detecting part to control the flow rate regulating part.

First claim

The invention claimed is:

1. A heating vaporization system comprising:
a container that comprises a tank that contains a source and a heating device that heats and vaporizes the source in the tank to produce a source gas;
a pipe connected to the tank and arranged downstream of the tank through which the source gas from the tank flows;
a sensor flow path that branches from the pipe and meets the pipe again;
a flow rate detecting part that comprises a thermal type flow rate sensor provided in the sensor flow path and measures a flow rate of the source gas flowing through the pipe, the thermal type flow rate sensor comprising an upstream side sensor that is coiled around an upstream side of the sensor flow path and a downstream side sensor that is coiled around a downstream side of the sensor flow path;
a flow rate regulating part that is provided upstream of the flow rate detecting part and downstream of the container, to regulate the flow rate of the source gas flowing through the pipe;
a control part that uses a flow rate measurement taken by the flow rate detecting part to control the flow rate regulating part;
one or more heaters arranged in each of the flow rate detecting part and the flow rate regulating part; and
an internal heater arranged inside the pipe located on an upstream side or a downstream side of the flow rate regulating part and adapted to heat the source gas,

wherein
the heating device and the one or more heaters are configured to separately control temperatures of the tank, the flow rate detecting part, and the flow rate regulating part,
the one or more heaters are configured to control a temperature of the flow rate detecting part to be equal to or lower than a temperature of the flow rate regulating part,

and
the internal heater includes:
a hollow metal cylinder of which an outer circumferential surface is configured to fit along an inner circumferential surface of the pipe; and
a metal mesh heating element disposed within the hollow metal cylinder.

2. The heating vaporization system according to claim 1 , wherein the internal heater is arranged inside the pipe and is located between the downstream side of the flow rate regulating part and an upstream side of the flow rate detecting part.

3. A heating vaporization method, comprising:
heating and vaporizing a liquid source contained inside a container to produce a source gas, and leading the source gas out into a pipe connected to the container;
providing a sensor flow path that branches from the pipe and meets the pipe again, and measuring via a flow rate detecting part a flow rate of the source gas flowing through the pipe with use of a thermal flow rate sensor provided in the sensor flow path, the thermal type flow rate sensor comprising an upstream side sensor that is coiled around an upstream side of the sensor flow path and a downstream side sensor that is coiled around a downstream side of the sensor flow path;
regulating the flow rate of the source gas via a flow rate regulating part provided upstream of the flow rate detecting part and downstream of the container, based upon a flow rate measurement taken by the flow rate detecting part;
heating each of the flow rate detecting part and the flow rate regulating part;
heating the source gas with an internal heater arranged inside the pipe located between the flow rate regulating part and the flow rate detecting part, wherein the internal heater includes a hollow metal cylinder of which an outer circumferential surface is configured to fit along an inner circumferential surface of the pipe and a metal mesh heating element disposed within the hollow metal cylinder;
separately controlling temperatures of the container, the flow rate detecting part, and the flow rate regulating part; and
controlling a temperature of the flow rate detecting part to be equal to or lower than a temperature of the flow rate regulating part.

4. The heating vaporization system according to claim 1 , wherein
the heating device is configured to control the temperature of a liquid source in the tank so as to reach saturated vapor pressure.

5. The heating vaporization system according to claim 1 , wherein
a heater arranged in the flow rate regulating part is configured to control the temperature of the flow rate regulating part so as to prevent the source gas from being liquefied in the flow rate regulating part.

6. The heating vaporization system according to claim 5 , wherein
the temperature of the flow rate regulating part is set based on a pressure loss in the flow rate regulating part.

7. The heating vaporization system according to claim 5 , wherein
the flow rate regulating part causes a temperature of the source gas in the pipe to approximate a temperature of the sensor flow path.

8. The heating vaporization system according to claim 1 , wherein
a heater arranged in the flow rate detecting part is configured to control the temperature of the flow rate detecting part so as to prevent the source gas from being liquefied in the flow rate detecting part.

Assignees

• Horiba Stec Co Ltd

Inventors

• Terasaka Masanori

Classifications

• C23C16/4485 Primary

  by evaporation without using carrier gas in contact with the source material (C23C16/4486 takes precedence) · CPC title

• B01D1/0082

  Regulation; Control · CPC title

• F17C2270/0518

  Semiconductors · CPC title

• F27D2019/0028

  Regulation · CPC title

• B05D1/26

  performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface · CPC title