Arrangement with circuit carrier for an electronic device

Patent metadata

Field	Value
Publication number	US-10211550-B2
Application number	US-201715458582-A
Country	US
Kind code	B2
Filing date	Mar 14, 2017
Priority date	Sep 23, 2014
Publication date	Feb 19, 2019
Grant date	Feb 19, 2019

Abstract

An arrangement for an electronic device is disclosed. A plurality of electrically conductive pins is positioned in respective vias of the circuit carrier, the pins extend from a first face of the circuit carrier to a contact end in order to electrically contact one or more components. The arrangement is equipped with an electrically insulating layer on a circuit carrier face, which is the first or a second face, in the region of the pin, the insulating layer having a prefabricated element which is positioned on the face of the circuit carrier. A portion of each pin, the portion being arranged adjacently to the respective via on the face, is surrounded by the material of the insulating layer in a continuously lateral manner.

First claim

The invention claimed is:

1. An arrangement for a control unit for a motor vehicle, comprising a circuit carrier, the circuit carrier being configured in the form of a plate with a first side and a second side, wherein a plurality of pins are positioned in respective vias of the circuit carrier, the pins being at least one of pressed into the vias and held in the vias by a soldered connection, wherein the pins extend from the first side to a contact end for electrically contacting to one or more components,
wherein on at least one of the first side and the second side of the circuit carrier, an electrically insulating layer having a prefabricated body is arranged in a region of the pins, and wherein a section of each pin adjacent to the respective via is arranged on said at least one of the first side and the second side and is laterally continuously enclosed by material of the electrically insulating layer,
wherein each of the pins has a coating which contains at least one of tin and zinc,
the pins are pressed into the vias, and
at least one pin is at least partly uncovered from the coating in at least one of a region of the via and the section of the at least one pin laterally continuously enclosed by the electrically insulating layer, the coating scraped from the at least one pin at the at least one of the region of the via and the section laterally continuously enclosed by the electrically insulating layer.

2. The arrangement according to claim 1 , wherein the prefabricated body rests against the circuit carrier.

3. The arrangement according to claim 1 , further comprising a centering strip through which the pins are guided, wherein the prefabricated body is arranged between the centering strip and the circuit carrier, the prefabricated body and at least one of the centering strip and the circuit carrier define an inner volume between the centering strip and the circuit carrier through which the pins extend, and the electrically insulating layer further comprises a casting material disposed in the inner volume such that the section of each pin is laterally continuously enclosed by the casting material of the electrically insulating layer.

4. The arrangement according to claim 1 , wherein the prefabricated body comprises a porous material of a foamed or elastic plastic material, and that the pins are at least one of pressed through the porous material and arranged in passage openings in the porous material such that for each pin, the section thereof is adjacent to the respective via.

5. The arrangement according to claim 1 , wherein the prefabricated body is formed from a solid plastic material.

6. The arrangement according to claim 1 , wherein the prefabricated body has a plurality of through-openings, wherein the section of a first pin of the plurality of pins, which is adjacent to a respective via of the plurality of vias, is arranged in a respective through-opening of the plurality of through-openings so that the respective through-opening continuously encloses the section of the first pin, and the section of the first pin is adjacent to the respective through-opening.

7. The arrangement according to claim 1 , wherein the prefabricated body has a plurality of through-openings, and at least one pin of the plurality of pins is arranged in at least one through-opening such that the section of the at least one pin is adjacent to the respective via of the plurality of vias and the through-openings are filled with a casting material.

8. The arrangement according to claim 7 , wherein the at least one through-opening is connected to at least one other through-opening of the plurality of through-openings by one or more lateral passages at least partly defined in the prefabricated body.

9. The arrangement according to claim 1 , further comprising a centering strip in which the pins are guided, wherein the prefabricated body is arranged between the centering strip and the circuit carrier.

10. The arrangement according to claim 9 , wherein the centering strip is formed integrally with the prefabricated body.

11. The arrangement according to claim 9 , further comprising at least one spring element which presses the prefabricated body against the at least one of the first side and the second side of the circuit carrier.

12. The arrangement as claimed in claim 11 , wherein the spring element is arranged between the centering strip and the prefabricated body in order to press the prefabricated body against the circuit carrier.

13. The arrangement according to claim 9 , wherein the prefabricated body is attached to at least one of the circuit carrier and the centering strip, the attachment comprising at least one of one or more detent lugs, one or more scraper ribs, and an adhesive.

14. The arrangement according to claim 1 , wherein the section of each pin which is laterally enclosed by material of the insulating layer begins at the respective via and extends around a complete circumference of the pin.

15. The arrangement according to claim 1 , wherein the section of each pin adjoins the at least one of the first side and the second side of the circuit carrier and extends away from the circuit carrier in a longitudinal direction of the pin, the sections of the pins being separated from one another by side walls formed by the electrically insulating layer.

16. The arrangement according to claim 15 , wherein the electrically insulating layer covers 50% or less of the at least one of the first side and the second side of the circuit carrier.

17. The arrangement according to claim 15 , wherein the prefabricated body is fixed to the circuit carrier by an adhesive layer or an adhesive film.

18. The arrangement according to claim 15 , wherein the prefabricated body has a plurality of through-openings and for each pin of the plurality of pins, the section of the pin is adjacent to the respective via and arranged in a respective through-opening of the plurality of through-openings so that the respective through-opening is adjacent to and continuously encloses the section of the pin.

19. The arrangement according to claim 1 , wherein the section of each pin is adjacent the first side of the circuit carrier, extends in a longitudinal direction of the pin away from the circuit carrier and is surrounded by a side wall of the electrically insulating layer, each side wall laterally extends around the section of the corresponding pin such that the section of the pins are separated from one another by the side walls.

20. The arrangement according to claim 1 , wherein the section of each pin is adjacent the first side of the circuit carrier and extends in a longitudinal direction of the pin away from the circuit carrier, the electrically insulating layer includes a plurality of side walls, each side wall laterally extends around the section of a corresponding pin such that the section of the pins are separated from one another by the side walls.

21. An arrangement for a control unit for a motor vehicle, comprising a circuit carrier, the circuit carrier being configured in the form of a plate with a first side and a second side, wherein a plurality of pins are positioned in respective vias of the circuit carrier, the pins being at least one of pressed into the vias and held in the vias by a soldered connection, wherein the pins extend from the first side to a contact end for electrically contacting to one or more components,
wherein on at least one of the first side and the second side of the circuit carrier, an electrically insulating layer

Assignees

• Continental Automotive Gmbh

Inventors

• Decker Michael
• Riepl Thomas
• Schlotter Holger

Classifications

• H05K2201/10424

  Frame holders · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K2201/10303

  Pin-in-hole mounted pins · CPC title

• H01R12/58 Primary

  terminals for insertion into holes · CPC title

• H05K2201/0116

  Porous, e.g. foam · CPC title