Semiconductor component arrangement, method for fabrication thereof and heat dissipation device
US-12512386-B2 · Dec 30, 2025 · US
Riepl Thomas is listed as an inventor on 41 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Riepl Thomas |
| Total patents | 41 |
| First publication | Apr 9, 2015 |
| Latest publication | Dec 30, 2025 |
Publications ranked by popularity score, then publication date.
US-12512386-B2 · Dec 30, 2025 · US
US-2024297093-A1 · Sep 5, 2024 · US
US-12046531-B2 · Jul 23, 2024 · US
US-12046863-B2 · Jul 23, 2024 · US
US-2023358627-A1 · Nov 9, 2023 · US
US-11798873-B2 · Oct 24, 2023 · US
US-11503719-B2 · Nov 15, 2022 · US
US-11362511-B2 · Jun 14, 2022 · US
US-2022115290-A1 · Apr 14, 2022 · US
US-2021384689-A1 · Dec 9, 2021 · US
Latest publications not already listed above.
US-2021202366-A1 · Jul 1, 2021 · US
US-2020288579-A1 · Sep 10, 2020 · US
US-10691117-B2 · Jun 23, 2020 · US
US-2019372337-A1 · Dec 5, 2019 · US
US-10421421-B2 · Sep 24, 2019 · US
US-10276482-B2 · Apr 30, 2019 · US
US-10244645-B2 · Mar 26, 2019 · US
US-10211550-B2 · Feb 19, 2019 · US
US-10206275-B2 · Feb 12, 2019 · US
US-10180550-B2 · Jan 15, 2019 · US
US-2018196208-A1 · Jul 12, 2018 · US
US-9961805-B2 · May 1, 2018 · US
US-9901004-B2 · Feb 20, 2018 · US
US-2018046174-A1 · Feb 15, 2018 · US
US-2018014418-A1 · Jan 11, 2018 · US
US-9865952-B2 · Jan 9, 2018 · US
US-9756717-B2 · Sep 5, 2017 · US
US-2017236777-A1 · Aug 17, 2017 · US
US-2017210308-A1 · Jul 27, 2017 · US
US-2017187131-A1 · Jun 29, 2017 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Continental Automotive Gmbh | 27 |
| Vitesco Tech Gmbh | 12 |
| Cpt Group Gmbh | 2 |
| Conti Temic Microelectronic Gmbh | 1 |
| Schaeffler Technologiesag& Co Kg | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/65 | 8 |
| H01L23/49838 | 8 |
| H05K1/181 | 8 |
| H05K1/0209 | 8 |
| H05K5/0017 | 7 |