Alignment mark arrangement, semiconductor workpiece, and method for aligning a wafer

Patent metadata

Field	Value
Publication number	US-10199330-B2
Application number	US-201314138161-A
Country	US
Kind code	B2
Filing date	Dec 23, 2013
Priority date	Dec 23, 2013
Publication date	Feb 5, 2019
Grant date	Feb 5, 2019

Abstract

In various embodiments, an alignment mark arrangement may include a plurality of alignment marks disposed next to each other in a row, wherein at least one of the following holds true: a first alignment mark of the plurality of alignment marks has a first width and a second alignment mark of the plurality of alignment marks has a second width that is different from the first width; a first pair of neighboring alignment marks of the plurality of alignment marks is arranged at a first pitch and a second pair of neighboring alignment marks of the plurality of alignment marks is arranged at a second pitch that is different from the first pitch.

First claim

What is claimed is:

1. An alignment mark arrangement, comprising:
a plurality of alignment marks disposed next to each other in a row extending along a first direction, the plurality of alignment marks comprising a first outermost alignment mark, a second outermost alignment mark, and at least one inner alignment mark disposed between the first and second outermost alignment marks,
wherein the alignment mark arrangement comprises an asymmetry in at least one of a pitch and a width of the alignment marks, the width being measured along the first direction, and
wherein the first and second outermost alignment marks and every alignment mark disposed between the first and second outermost alignment marks has a greatest dimension that extends along a second direction, the second direction transverse to the first direction, and
wherein a pitch between the first outermost alignment mark and a first inner alignment mark that neighbors the first outermost alignment mark is different than a pitch between first inner alignment mark and an alignment mark neighboring the first inner alignment mark on a side opposite to the first outermost alignment mark,
wherein the alignment mark neighboring the first inner alignment mark on a side opposite to the first outermost alignment mark is a further inner alignment mark.

2. The alignment mark arrangement of claim 1 ,
wherein at least two alignment marks of the plurality of alignment marks have different widths.

3. The alignment mark arrangement of claim 1 ,
wherein at least two pairs of neighboring alignment marks have different pitches.

4. The alignment mark arrangement of claim 1 ,
wherein the further inner alignment mark is an innermost alignment mark.

5. The alignment mark arrangement of claim 4 , further comprising:
a second innermost alignment mark neighboring the further inner alignment mark.

6. The alignment mark arrangement of claim 1 ,
wherein the first and second outermost alignment marks have a length greater than a length of each alignment mark disposed between the first and second pair of outermost alignment marks, wherein the length is measured along the second direction.

7. The alignment mark arrangement of claim 1 ,
wherein the plurality of alignment marks includes an even number of alignment marks.

8. The alignment mark arrangement of claim 1 , wherein the plurality of alignment marks are located in a kerf region of a semiconductor workpiece.

9. An alignment mark arrangement, comprising:
a plurality of alignment marks disposed next to each other in a row extending along a first direction, the plurality of alignment marks comprising a first outermost alignment mark, a second outermost alignment mark, and at least one inner alignment mark disposed between the first and second outermost alignment marks,
wherein the alignment mark arrangement comprises an asymmetry in at least one of a pitch and a width of the alignment marks, the width being measured along the first direction, and
wherein the first and second outermost alignment marks and every alignment mark disposed between the first and second outermost alignment marks has a greatest dimension that extends along a second direction, the second direction transverse to the first direction, and
wherein a pitch between the first outermost alignment mark and a first inner alignment mark that neighbors the first outermost alignment mark is different than a pitch between first inner alignment mark and an alignment mark neighboring the first inner alignment mark on a side opposite to the first outermost alignment mark,
wherein a pitch between the second outermost alignment mark and a second inner alignment mark that neighbors the second outermost alignment mark is different than a pitch between second inner alignment mark and an alignment mark neighboring the second inner alignment mark on a side opposite to the second outermost alignment mark.

10. The alignment mark arrangement of claim 9 ,
wherein the alignment mark neighboring the second inner alignment mark on a side opposite to the second outermost alignment mark is a second further inner alignment mark.

11. The alignment mark arrangement of claim 10 ,
wherein the second further inner alignment mark is an innermost alignment mark.

Assignees

• Infineon Technologies Ag

Inventors

• Woerz Andreas
• Steinkirchner Erwin

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10W46/503

  Located in scribe lines · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/101

  characterised by the type of information, e.g. logos or symbols · CPC title

• H10W46/00 Primary

  Marks applied to devices, e.g. for alignment or identification · CPC title