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Phase change heat sink for transient thermal management
US9036352B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9036352-B2 |
| Application number | US-201213690029-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 30, 2012 |
| Priority date | Nov 30, 2012 |
| Publication date | May 19, 2015 |
| Grant date | May 19, 2015 |
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Abstract
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A heat dissipating assembly, for dissipating heat, having at least one heat producing component and a heat sink having phase change material conductively coupled to the at least one heat producing component.
First claim
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What is claimed is: 1. A clamshell assembly for a printed circuit board (PCB) having at least one heat producing component, comprising: an upper thermal plane defining a first portion of the clamshell; a lower thermal plane spaced from the upper thermal plane to partially define a PCB chamber for holding the PCB and defining a second portion of the clamshell; and a heat sink with a phase change material mounted to one of the upper thermal plane and the lower thermal plane; w…
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Frequently asked questions
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- What does patent US9036352B2 cover?
- A heat dissipating assembly, for dissipating heat, having at least one heat producing component and a heat sink having phase change material conductively coupled to the at least one heat producing component.
- Who is the assignee on this patent?
- Ge Aviat Systems Llc, Ge Aviat Systems Llc
- What technology area does this patent fall under?
- Primary CPC classification H10W40/73. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 19 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).