Method of cooling a composition using a hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system

Patent metadata

Field	Value
Publication number	US-10176973-B2
Application number	US-201715411711-A
Country	US
Kind code	B2
Filing date	Jan 20, 2017
Priority date	Mar 6, 2014
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

Embodiments disclosed herein include a method for abating compounds produced in semiconductor processes. The method includes energizing an abating agent, forming a composition by reacting the energized abating agent with gases exiting a vacuum processing chamber, and flowing the composition through a plurality of holes formed in a cooling plate. By cooling the composition with the cooling plate, damages on the downstream pump are avoided.

First claim

What is claimed is:

1. A method for cooling a composition, comprising:
energizing an abating agent in a plasma source by applying RF power to an electrode disposed in a body of the plasma source, wherein the plasma source is disposed downstream of a vacuum processing chamber;
forming a composition by reacting the energized abating agent with gases exiting the vacuum processing chamber; and
flowing the composition through an exhaust cooling apparatus, wherein the exhaust cooling apparatus comprises a first end, a second end, and a cooling plate disposed between the first end and the second end, wherein the cooling plate comprises a plurality of holes and a major surface substantially perpendicular to an axis extending from the first end to the second end.

2. The method of claim 1 , wherein the abating agent is selected from the group consisting of CH 4 , H 2 O, H 2 , NF 3 , SF 6 , F 2 , HCl, HF, Cl 2 , HBr, O 2 , N 2 , O 3 , CO, CO 2 , NH 3 , N 2 O, and combinations thereof.

3. The method of claim 1 , wherein energizing the abating agent further comprises;
forming a plasma.

4. The method of claim 1 , wherein the plasma source is coupled to the exhaust cooling apparatus.

5. The method of claim 1 , further comprising:
flowing a coolant through the cooling plate.

6. The method of claim 5 , wherein the coolant is water.

7. A method for cooling a composition, comprising:
energizing an abating agent in a plasma source by applying RF power to an electrode disposed in a body of the plasma source, wherein the plasma source is disposed downstream of a vacuum processing chamber;
forming a composition by reacting the energized abating agent with gases exiting the vacuum processing chamber; and
flowing the composition into an exhaust cooling apparatus, wherein the exhaust cooling apparatus comprises:
a first end;
a second end, wherein a cavity is formed between the first end and the second end; and
a cooling plate disposed in the cavity, wherein the cooling plate comprises a plurality of holes and a major surface substantially perpendicular to an axis extending from the first end to the second end, wherein the composition is flowed through the plurality of holes.

8. The method of claim 7 , wherein the abating agent is selected from the group consisting of CH 4 , H 2 O, H 2 , NF 3 , SF 6 , F 2 , HCl, HF, Cl 2 , HBr, O 2 , N 2 , O 3 , CO, CO 2 , NH 3 , N 2 O, and combinations thereof.

9. The method of claim 7 , wherein energizing the abating agent comprises:
forming a plasma from the abating agent.

10. The method of claim 7 , wherein the plasma source is coupled to the exhaust cooling apparatus.

11. The method of claim 7 further comprising:
flowing a coolant through the cooling plate.

12. The method of claim 11 , wherein the coolant is water.

Assignees

• Applied Materials Inc

Inventors

• Cox Michael S
• Wang Rongping
• West Brian T
• Johnson Roger M
• Dickinson Colin John

Classifications

• H10P14/6903

  containing silicon · CPC title

• H10P14/6336

  in the presence of a plasma [PECVD] · CPC title

• H01J37/32082 Primary

  Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence) · CPC title

• H01J37/32596

  Hollow cathodes · CPC title

• H01J37/32541

  Shape · CPC title