Oven enclosure for optical components with integrated purge gas pre-heater

Patent metadata

Field	Value
Publication number	US-10153215-B2
Application number	US-201615358507-A
Country	US
Kind code	B2
Filing date	Nov 22, 2016
Priority date	Aug 4, 2016
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

A cartridge in an oven enclosure includes a pre-heating feature for an incoming purge gas before the purge gas enters the space around an optical component, such as a nonlinear optical crystal, in an oven cell. The incoming purge gas can be pre-heated as it travels along a gas pathway around a cartridge. The cartridge can include a heater. The oven enclosure can have two windows positioned such that a laser beam can enter through one of the windows, pass through the optical component, and exit through another of the windows. A second harmonic beam can be generated with the optical component.

First claim

What is claimed is:

1. An oven enclosure comprising:
a plurality of walls defining an oven chamber; and
a cartridge disposed in the walls, wherein the cartridge includes:
a cartridge block;
a mount disposed on a first surface of the cartridge block, wherein the mount is configured to hold an optical component;
a gas pathway disposed on the cartridge block, wherein the gas pathway includes tubing wound around a surface of the cartridge block; and
a heater disposed on the cartridge block;

a purge gas inlet disposed in one of the walls, wherein the purge gas inlet is configured to be in fluid communication with the gas pathway;
two windows disposed in the walls, wherein the windows are positioned such that a laser beam enters through one of the windows, passes through the optical component, and exits through another of the windows; and
a purge gas outlet disposed in one of the walls, wherein the purge gas outlet is configured to be in fluid communication with the oven chamber.

2. The oven enclosure of claim 1 , wherein the tubing is fabricated of a metal.

3. The oven enclosure of claim 1 , further comprising an optical component disposed on the mount, wherein the optical component is a non-linear optical crystal.

4. The oven enclosure of claim 1 , wherein the mount is spring-loaded.

5. The oven enclosure of claim 4 , wherein the mount has a spring force from 10 to 100 times a weight of the optical component.

6. The oven enclosure of claim 1 , further comprising a purge gas source, wherein the purge gas source contains at least one of air, nitrogen, or argon.

7. The oven enclosure of claim 1 , further comprising a filter disposed in fluid communication with the purge gas inlet, wherein the filter is configured to remove at least one of volatile organic compounds, humidity, or particles.

8. The oven enclosure of claim 1 , further comprising a seal disposed between the cartridge and one of the walls.

9. The oven enclosure of claim 1 , wherein the gas pathway has a helical pattern around the cartridge block.

10. The oven enclosure of claim 1 , wherein the heater is disposed at least partly inside the cartridge block.

11. The oven enclosure of claim 1 , wherein the windows include an anti-reflection coating for light having one or multiple wavelengths.

12. The oven enclosure of claim 1 , wherein the windows are configured to be tilted at Brewster's angle relative to a beam propagation direction of the laser beam thereby minimizing reflection of polarized laser radiation.

13. A method comprising:
providing an oven enclosure;
disposing a cartridge in the oven enclosure, wherein the cartridge includes:
a cartridge block;
a mount disposed on a first surface of the cartridge block, wherein the mount is configured to hold an optical component;
a gas pathway disposed on the cartridge block, wherein the gas pathway includes tubing wound around a surface of the cartridge block; and
a heater disposed on the cartridge block;

biasing the heater;
flowing a purge gas through the gas pathway into the oven enclosure, wherein the heater is configured to increase a temperature of the purge gas as the purge gas flows through the gas pathway; and
directing a laser beam through the oven enclosure.

Assignees

• Kla Tencor Corp

Inventors

• Woll Dirk

Classifications

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• G01N21/9501

  Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

• F27D21/02

  Observation or illuminating devices · CPC title

• G03F7/7065

  Defects, e.g. optical inspection of patterned layer for defects · CPC title