Substrate cutting apparatus and method of manufacturing display apparatus by using a substrate cutting apparatus

Patent metadata

Field	Value
Publication number	US-10137532-B2
Application number	US-201414330421-A
Country	US
Kind code	B2
Filing date	Jul 14, 2014
Priority date	Feb 27, 2014
Publication date	Nov 27, 2018
Grant date	Nov 27, 2018

Abstract

A substrate cutting apparatus and a method of manufacturing a display apparatus by using the substrate cutting apparatus, so that an occurrence of an error in cutting a substrate may be prevented and the substrate may be exactly cut. The substrate cutting apparatus includes an integrated laser beam oscillator where an infrared wavelength laser beam oscillator and a short pulse laser beam oscillator are adjacent to each other and are fixed; a stage on which a substrate is disposed; and a transfer unit that transfers at least one of the substrate and the integrated laser beam oscillator so as to control a short pulse laser beam to be irradiated on a region of the substrate, on which an infrared wavelength laser beam emitted from the integrated laser beam oscillator has just been irradiated.

First claim

What is claimed is:

1. A method of manufacturing a display apparatus, the method comprising:
cutting a substrate by irradiating the substrate with a laser beam, the substrate comprising a first plurality of layers and a second plurality of layers, and a plurality of display units for displaying images,
wherein the cutting the substrate comprises:
irradiating a region of the substrate with an infrared wavelength laser beam to cut the first plurality of layers; and
irradiating the region of the substrate with a short pulse laser beam after the complete cut of the first plurality of layers, the short pulse laser beam having a visible wavelength of approximately 515 nm with a pulse in a picosecond range, to cut the second plurality of layers.

2. The method of claim 1 , wherein the cutting is performed by using an integrated laser beam oscillator that includes an infrared wavelength laser beam oscillator and a short pulse laser beam oscillator that is disposed adjacent to the infrared wavelength laser beam oscillator.

3. The method of claim 1 , wherein the infrared wavelength laser beam is emitted by a carbon dioxide laser beam oscillator.

4. The method of claim 1 , wherein the substrate is a stack comprising a first layer, a second layer, and a third layer, wherein the first layer and the third layer are made of a same material and the second layer is made of a different material from that of the first and third layers, and wherein the second layer is disposed between the first layer and the third layer.

5. The method of claim 4 , wherein the first layer and the third layer comprise polyethylene terephthalate, and the second layer comprises polyimide and is positioned between the first layer and the third layer.

6. The method of claim 4 , wherein irradiating a region of the substrate with an infrared wavelength laser beam comprises irradiating one of the first layer and the third layer of the substrate with the infrared wavelength laser beam, and irradiating the region of the substrate with a short pulse laser beam comprises irradiating the second layer and the other of the first layer and the third layer with the short pulse laser beam.

7. The method of claim 1 , wherein the region of the substrate is a region between the display units.

8. A method of cutting a substrate including a plurality of display units for displaying images, the substrate includes a stacked structure having a first layer, a second layer in direct contact with the first layer and a third layer in direct contact with the second layer, the first and the third layers are made of a same material and the second layer is made of a different material from that of the first and third layers, the method of cutting the substrate comprising:
irradiating a region of the substrate with an infrared wavelength laser beam to cut the third layer of the region of the substrate; and
irradiating the region of the substrate with a short pulse laser beam to cut the second and first layers of the region of the substrate after the complete cut of the third layer of the region of the substrate, the short pulse laser beam having a visible wavelength of approximately 515 nm with a pulse in a picosecond range.

9. The method of claim 8 , wherein the infrared wavelength laser beam is generated by an infrared wavelength laser beam oscillator, and the short pulse laser beam is generated by a short pulse laser beam oscillator, the infrared wavelength laser beam oscillator is disposed adjacent to the short pulse laser beam oscillator in a fixed position.

10. The method of claim 8 , wherein the infrared wavelength laser beam is emitted by a carbon dioxide laser beam.

11. The method of claim 8 , wherein the first layer and the third layer comprise polyethylene terephthalate, and the second layer comprises polyimide and is positioned between the first layer and the third layer.

12. The method of claim 8 , wherein the region of the substrate is a region between the display units.

13. A method of cutting a substrate including a first layer and a second layer, the method comprising:
irradiating a portion of the first layer with a first type of laser beam and removing the irradiated portion of the first layer; and
irradiating a portion of the second layer with a second type of laser beam and removing the irradiated portion of the second layer after the complete cut of the first layer;
wherein the first type of laser beam has an infrared wavelength and the second type of laser beam has a visible wavelength with a picosecond pulse, and
wherein the visible wavelength with the picoseconds pulse is colored green in a predominant wavelength between 495 nm and 570 nm.

14. The method of claim 13 , wherein the second layer includes polyimide.

15. The method of claim 13 , wherein the first layer and second layer are disposed in a different cutting side of the display panel.

Assignees

• Samsung Display Co Ltd

Inventors

• Sung Tae-Hyun
• Lee Hyun-Gu
• Kim Young-Gu
• Oh Jeong-Il

Classifications

• B23K26/40 Primary

  taking account of the properties of the material involved · CPC title

• B23K26/0613

  having a common axis (B23K26/0619 takes precedence) · CPC title

• B23K2203/172

  Operations & Transport · mapped topic

• B23K26/38

  by boring or cutting · CPC title

• B23K2103/172

  wherein at least one of the layers is non-metallic · CPC title