Thin-film devices and fabrication
US-2024082949-A1 · Mar 14, 2024 · US
wherein at least one of the layers is non-metallic
wherein at least one of the layers is non-metallic · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K2103/172 |
| Official title | {wherein at least one of the layers is non-metallic} |
| Display label | wherein at least one of the layers is non-metallic |
| Total patents | 812 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 74 |
| 2016 | 95 |
| 2017 | 97 |
| 2018 | 61 |
| 2019 | 100 |
| 2020 | 91 |
| 2021 | 61 |
| 2022 | 81 |
| 2023 | 55 |
| 2024 | 56 |
| 2025 | 32 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bird protection glazing
US-2015375485-A1 · Dec 31, 2015 · US
Wafer dicing from wafer backside and front side
US-9224650-B2 · Dec 29, 2015 · US
Laser and plasma etch wafer dicing using water-soluble die attach film
US-9224625-B2 · Dec 29, 2015 · US
Laser processing apparatus and container manufacturing apparatus
US-9221123-B2 · Dec 29, 2015 · US
Hybrid laser and plasma etch wafer dicing using substrate carrier
US-9218992-B2 · Dec 22, 2015 · US
Method for joining a composite sheet to a metallic substrate
US-9211605-B2 · Dec 15, 2015 · US
Layer-selective laser ablation patterning
US-9209400-B2 · Dec 8, 2015 · US
Resistance spot welding method
US-2015306697-A1 · Oct 29, 2015 · US
Conveyor belt with zero stage splice
US-2015307281-A1 · Oct 29, 2015 · US
Laminated material and method of production thereof
US-9169054-B2 · Oct 27, 2015 · US
Areal component arrangement for a vehicle body, vehicle body with the areal component arrangement and method for welding an areal component of the areal component arrangement
US-2015291226-A1 · Oct 15, 2015 · US
Plastic capacitive touch screen and method of manufacturing same
US-9158386-B2 · Oct 13, 2015 · US
Laser processing method and production method of multilayer flexible printed wiring board using laser processing method
US-9148963-B2 · Sep 29, 2015 · US
Method for the new production of through holes in a layer system
US-2015258634-A1 · Sep 17, 2015 · US
Laser and plasma etch wafer dicing using physically-removable mask
US-9126285-B2 · Sep 8, 2015 · US
Hybrid dicing process using a blade and laser
US-9130057-B1 · Sep 8, 2015 · US
Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
US-9129904-B2 · Sep 8, 2015 · US
Singulation of layered materials using selectively variable laser output
US-9120181-B2 · Sep 1, 2015 · US
Substrate cutting apparatus and method of manufacturing display apparatus by using a substrate cutting apparatus
US-2015239066-A1 · Aug 27, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K2103/172?
- CPC B23K2103/172 is the Cooperative Patent Classification code for “wherein at least one of the layers is non-metallic.”
- How many patents are filed under CPC B23K2103/172 (wherein at least one of the layers is non-metallic)?
- Our database includes 812 publications tagged with this CPC code.
- Is patent activity under CPC B23K2103/172 growing?
- Publication counts under this code: 56 in 2024 vs 32 in 2025 (latest complete years).