Direct diode laser processing apparatus and sheet metal processing method using the same
US-10471537-B2 · Nov 12, 2019 · US
having a common axis (B23K26/0619 takes precedence)
having a common axis (B23K26/0619 takes precedence) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K26/0613 |
| Official title | {having a common axis (B23K26/0619 takes precedence)} |
| Display label | having a common axis (B23K26/0619 takes precedence) |
| Total patents | 176 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 9 |
| 2017 | 18 |
| 2018 | 10 |
| 2019 | 21 |
| 2020 | 19 |
| 2021 | 18 |
| 2022 | 25 |
| 2023 | 20 |
| 2024 | 6 |
| 2025 | 8 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Feature and depth measurement using multiple beam sources and interferometry
US-2019301854-A1 · Oct 3, 2019 · US
Laser Cutting Machine and Method for Cutting Workpieces of Different Thicknesses
US-2019262939-A1 · Aug 29, 2019 · US
Laser machining device and laser machining method
US-2019176271-A1 · Jun 13, 2019 · US
Feature and depth measurement using multiple beam sources and interferometry
US-10302416-B2 · May 28, 2019 · US
Laser processing of sapphire substrate and related applications
US-10179748-B2 · Jan 15, 2019 · US
Method for rapid laser drilling of holes in glass and products made therefrom
US-10144093-B2 · Dec 4, 2018 · US
Substrate cutting apparatus and method of manufacturing display apparatus by using a substrate cutting apparatus
US-10137532-B2 · Nov 27, 2018 · US
Laser nanomachining device and method
US-10131017-B2 · Nov 20, 2018 · US
Overlapping border and internal sections of object formed by different am melting beam sources in overlapping field region
US-2018281112-A1 · Oct 4, 2018 · US
Laser welding method and laser welding device
US-2018178321-A1 · Jun 28, 2018 · US
Substrate processing method
US-2018161921-A1 · Jun 14, 2018 · US
Annealing apparatus using two wavelengths of radiation
US-2018099353-A1 · Apr 12, 2018 · US
Semiconductor laser oscillator
US-9917416-B2 · Mar 13, 2018 · US
Apparatus and method of improving beam shaping and beam homogenization
US-9908200-B2 · Mar 6, 2018 · US
Multi-laser system and method for cutting and post-cut processing hard dielectric materials
US-2018001425-A1 · Jan 4, 2018 · US
Annealing apparatus using two wavelengths of radiation
US-9839976-B2 · Dec 12, 2017 · US
Direct diode laser processing apparatus and sheet metal processing method using the same
US-2017304941-A1 · Oct 26, 2017 · US
Feature and depth measurement using multiple beam sources and interferometry
US-2017299373-A1 · Oct 19, 2017 · US
Laser processing of sapphire substrate and related applications
US-2017291844-A1 · Oct 12, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K26/0613?
- CPC B23K26/0613 is the Cooperative Patent Classification code for “having a common axis (B23K26/0619 takes precedence).”
- How many patents are filed under CPC B23K26/0613 (having a common axis (B23K26/0619 takes precedence))?
- Our database includes 176 publications tagged with this CPC code.
- Is patent activity under CPC B23K26/0613 growing?
- Publication counts under this code: 6 in 2024 vs 8 in 2025 (latest complete years).