Printed wiring board

Patent metadata

Field	Value
Publication number	US-10134693-B2
Application number	US-201715412277-A
Country	US
Kind code	B2
Filing date	Jan 23, 2017
Priority date	Jan 21, 2016
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

A printed wiring board includes a lowermost resin insulating layer, a first conductor layer formed on first surface of the lowermost layer, a conductor post having upper surface facing the first surface of the lowermost layer, a metal post formed such that the metal post is protruding from second surface of the lowermost layer and is positioned at lower surface of the conductor post, an electronic component embedded in the lowermost layer such that the component is positioned on second surface side of the lowermost layer and has an electrode facing the first surface of the lowermost layer, and via conductors formed in the lowermost layer and including first and second via conductors such that the first via conductor is connecting the first conductor layer and the upper surface of the conductor post and the second via conductor is connecting the first conductor layer and the electrode of the component.

First claim

What is claimed is:

1. A printed wiring board, comprising:
a lowermost resin insulating layer;
a first conductor layer formed on a first surface of the lowermost resin insulating layer;
a conductor post formed in the lowermost resin insulating layer such that the conductor post has an upper surface facing the first surface of the lowermost resin insulating layer and a lower surface on an opposite side with respect to the upper surface;
a metal post formed on a second surface of the lowermost resin insulating layer such that the metal post is protruding from the second surface of the lowermost resin insulating layer and is positioned lower than the lower surface of the conductor post;
an electronic component embedded in the lowermost resin insulating layer such that the electronic component is positioned on a second surface side of the lowermost resin insulating layer and has an electrode facing the first surface of the lowermost resin insulating layer; and
a plurality of via conductors formed in the lowermost resin insulating layer and comprising a first via conductor and a second via conductor such that the first via conductor is connecting the first conductor layer and the upper surface of the conductor post and that the second via conductor is connecting the first conductor layer and the electrode of the electronic component,
wherein the metal post is positioned directly below the lower surface of the conductor post.

2. A printed wiring board, comprising:
a lowermost resin insulating layer;
a first conductor layer formed on a first surface of the lowermost resin insulating layer;
a conductor post formed in the lowermost resin insulating layer such that the conductor post has an upper surface facing the first surface of the lowermost resin insulating layer and a lower surface on an opposite side with respect to the upper surface;
a metal post formed on a second surface of the lowermost resin insulating layer such that the metal post is protruding from the second surface of the lowermost resin insulating layer and is positioned lower than the lower surface of the conductor post;
a second conductor layer formed between the metal post and the lower surface of the conductor post;
an electronic component embedded in the lowermost resin insulating layer such that the electronic component is positioned on a second surface side of the lowermost resin insulating layer and has an electrode facing the first surface of the lowermost resin insulating layer; and
a plurality of via conductors formed in the lowermost resin insulating layer and comprising a first via conductor and a second via conductor such that the first via conductor is connecting the first conductor layer and the upper surface of the conductor post and that the second via conductor is connecting the first conductor layer and the electrode of the electronic component.

3. A printed wiring hoard according to claim 2 , wherein the second conductor layer is embedded in the lowermost resin insulating layer such that the second conductor layer has a surface being in contact with the lower surface of the conductor post and an opposite surface exposed on the second surface of the lowermost resin insulating layer and being in contact with the metal post.

4. A printed wiring board according to claim 2 , wherein the second conductor layer is formed on the second surface of the lowermost resin insulating layer such that the second conductor layer has a surface being in contact with the lower surface of the conductor post and an opposite surface projecting from the second surface of the lowermost resin insulating layer and being in contact with the metal post.

5. A printed wiring board according to claim 2 , further comprising:
a lowermost conductor layer formed on the second surface of the lowermost resin insulating layer such that the lowermost conductor layer is projecting from the second surface of the lowermost insulating layer and is positioned between the metal post and the second conductor layer.

6. A printed wiring board according to claim 2 , wherein the second conductor layer includes a pad portion formed such that the pad portion of the second conductor layer has a surface in contact with the lower surface of the conductor post and an opposite surface in contact with the metal post.

7. A printed wiring board according to claim 5 , wherein the second conductor layer includes a pad portion formed such that the pad portion of the second conductor layer is in contact with the lower surface of the conductor post, the lowermost conductor layer has a pad portion such that the pad portion of the lowermost conductor layer is in contact with the metal layer and the pad portion of the second conductor layer.

8. A printed wiring board according to claim 1 , wherein the metal post is formed in a cylindrical shape.

9. A printed wiring board according to claim 1 , wherein the metal post comprises a seed layer and a plating layer formed on the seed layer.

10. A printed wiring board, comprising:
a lowermost resin insulating layer;
a first conductor layer formed on a first surface of the lowermost resin insulating layer;
a conductor post formed in the lowermost resin insulating layer such that the conductor post has an upper surface facing the first surface of the lowermost resin insulating layer and a lower surface on an opposite side with respect to the upper surface;
a metal post formed on a second surface of the lowermost resin insulating layer such that the metal post is protruding from the second surface of the lowermost resin insulating layer and is positioned lower than the lower surface of the conductor post;
an electronic component embedded in the lowermost resin insulating layer such that the electronic component is positioned on a second surface side of the lowermost resin insulating layer and has an electrode facing the first surface of the lowermost resin insulating layer; and
a plurality of via conductors formed in the lowermost resin insulating layer and comprising a first via conductor and a second via conductor such that the first via conductor is connecting the first conductor layer and the upper surface of the conductor post and that the second via conductor is connecting the first conductor layer and the electrode of the electronic component,
wherein the conductor post and the electronic component are positioned in the lowermost resin insulating layer such that a ratio K 1 /K 2 is in a range of 0.6 to 0.9 where K 1 is a distance between the upper surface of the conductor post and the first surface of the lowermost resin insulating layer, and K 2 is a distance between the electrode of the electronic component and the first surface of the lowermost resin insulating layer.

11. A printed wiring board according to claim 1 , wherein the metal post is configured to mount a circuit substrate to the lowermost resin insulating layer.

12. A printed wiring board according to claim 1 , further comprising:
a shield structure formed between the electronic component and the conductor post,
wherein the electronic component is a semiconductor element, and the shield structure is formed such that the shield structure is surrounding the semiconductor element.

13. A printed wiring board according to claim 12 , wherein the shield structure is connected to ground, and the shield structure comprises a plurality of shield conductor posts.

14. A printed wiring board according to claim 12 , wherein the shield structure is connected to ground, and the shield structure comprises a conductor wall.

15. A printed wiring board according to claim 14 , wherein the shield

Assignees

• Ibiden Co Ltd

Inventors

• Inagaki Yasushi

Classifications

• H10P72/7436

  used to support a device or a wafer when forming electrical connections thereto · CPC title

• H10P72/743

  used as a support during manufacture of interconnect decals or build up layers · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title