Air gap spacer formation for nano-scale semiconductor devices

Patent metadata

Field	Value
Publication number	US-10115629-B2
Application number	US-201715789416-A
Country	US
Kind code	B2
Filing date	Oct 20, 2017
Priority date	Aug 9, 2016
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

Semiconductor devices having air gap spacers that are formed as part of BEOL or MOL layers of the semiconductor devices are provided, as well as methods for fabricating such air gap spacers. For example, a method comprises forming a first metallic structure and a second metallic structure on a substrate, wherein the first and second metallic structures are disposed adjacent to each other with insulating material disposed between the first and second metallic structures. The insulating material is etched to form a space between the first and second metallic structures. A layer of dielectric material is deposited over the first and second metallic structures using a pinch-off deposition process to form an air gap in the space between the first and second metallic structures, wherein a portion of the air gap extends above an upper surface of at least one of the first metallic structure and the second metallic structure.

First claim

We claim:

1. A semiconductor device, comprising:
a first metallic structure and a second metallic structure disposed adjacent to each other on a substrate with a space disposed between the first and second metallic structures, wherein the first metallic structure comprises a gate structure of a transistor and wherein the second metallic structure comprises a source/drain contact; and
a dielectric capping layer formed over the first and second metallic structures to form an air gap in the space between the first and second metallic structures;
wherein an upper portion of the air gap is disposed above an upper surface the first metallic structure and below an upper surface of the second metallic structure; and
wherein a bottom portion of the air gap is disposed below a bottom surface of the second metallic structure.

2. The device of claim 1 , wherein the dielectric capping layer comprises a low-k dielectric material having a dielectric constant that is about 5.0 or less.

3. The device of claim 1 , wherein the dielectric capping layer comprises at least one of SiCOH, porous p-SiCOH, SiCN, SiNO, carbon-rich SiCNH, SiC, p-SiCNH, and SiN.

4. The device of claim 1 , further comprising a conformal liner layer formed on surfaces of the first and second metallic structures in the space between the first and second metallic structures.

5. The device of claim 1 , further comprising:
a BEOL (back-end-of-line) interconnect structure comprising a first metal line and a second metal line formed in an ILD (interlevel dielectric) layer, wherein the first metal line and the second metal line are disposed adjacent to each other with a space disposed between the first and second metal lines;
a second dielectric capping layer formed over the first and second metal lines to form an air gap in the space between the first and second metallic lines;
wherein an upper portion of the air gap is disposed above upper surfaces of the first and second metal lines.

6. The device of claim 5 , wherein the second dielectric capping layer comprises a low-k dielectric material having a dielectric constant that is about 5.0 or less.

7. The device of claim 5 , wherein the second dielectric capping layer comprises at least one of SiCOH, porous p-SiCOH, SiCN, SiNO, carbon-rich SiCNH, SiC, p-SiCNH, and SiN.

8. The device of claim 5 , further comprising a conformal liner layer within the space between the first and second metal lines.

Assignees

• IBM

Inventors

• Cheng Kangguo
• Haigh Thomas J
• Li Juntao
• Liniger Eric G
• Mehta Sanjay C
• Nguyen Son V
• Park Chanro
• Yamashita Tenko

Classifications

• H10P14/69433

  the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title

• H10P14/6922

  the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC · CPC title

• H10P14/6905

  being a silicon carbide or silicon carbonitride and not containing oxygen, e.g. SiC or SiC:H · CPC title

• H10P14/6336

  in the presence of a plasma [PECVD] · CPC title

• H10W20/48 Primary

  Insulating materials thereof · CPC title