Method of modifying a sample surface layer from a microscopic sample

Patent metadata

Field	Value
Publication number	US-10105734-B2
Application number	US-201614992743-A
Country	US
Kind code	B2
Filing date	Jan 11, 2016
Priority date	Jan 12, 2015
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A method of modifying a sample surface layer in the vacuum chamber of a particle-optical apparatus, the method performed in vacuum, the method comprising:
Providing the microscopic sample attached to a manipulator, Providing a first liquid at a first (controlled) temperature, Dipping the sample in the first liquid, thereby causing a sample surface modification, Removing the sample from the first liquid, Providing a second liquid at a second (controlled) temperature, Dipping the sample in the second liquid, and Removing the sample from the second liquid.

This enables the wet processing of a sample in-situ, thereby enhancing speed and/or avoiding subsequent alteration/contamination of the sample, such as oxidation, etc. The method is particularly useful for etching a lamella after machining the lamella with a (gallium) FIB to remove the surface layer where gallium implantation occurred, or where the crystal lattice is disturbed.

First claim

The invention claimed is:

1. Method of modifying a sample surface layer from a sample in a particle-optical apparatus, the method performed in vacuum, the method comprising:
providing the sample attached to a manipulator,
providing a first liquid at a first temperature, the first liquid including an etchant;
dipping the sample in the first liquid in a vacuum chamber of the particle-optical apparatus, thereby causing the sample surface layer to be etched,
removing the sample from the first liquid using the manipulator,
providing a second liquid, different from the first liquid, at a second temperature, the second liquid including a rinsing solution comprising ethanol or water, the second liquid being matched to the first liquid;
dipping the sample in the second liquid in the vacuum chamber to rinse the sample, and
removing the sample from the second liquid
in which the sample is a semiconductor lamella having gallium implantation and causing the sample surface layer to be etched includes etching less than 50 nm from the lamella surface to remove the implanted gallium.

2. The method of claim 1 in which the sample is attached to the manipulator by forming a weld using beam induced deposition, the beam induced deposition induced by a laser beam, an electron beam or an ion beam.

3. The method of claim 1 in which the sample has a dimension of less than 10 μm in any direction and the first liquid and the second liquid are deposited as droplets with a volume of less than 1 picoliter.

4. The method of claim 1 in which the step of providing the sample attached to a manipulator comprises the steps of:
providing a work piece,
attaching the sample to the manipulator, and
excising the sample from the work piece using a focused ion beam in the vacuum chamber.

5. The method of claim 1 in which dipping the sample in the first liquid in a vacuum chamber of the particle-optical apparatus thereby causing the sample surface layer to be etched includes electro-chemical etching, said electro-chemical etching using a non-virtual cathode.

6. The method of claim 5 in which the thickness of the removed sample surface layer is less than 10 nm.

7. The method of claim 1 in which the sample is rinsed repeatedly.

8. The method of claim 1 in which the two liquids are provided on one surface, the manipulator movable with respect to said surface.

9. The method of any claim 1 in which the liquids are applied using a first liquid insertion system and a second liquid insertion system.

10. The method of claim 1 in which the second temperature is different from the first temperature.

11. The method of claim 10 in which the rate of evaporation of the first liquid and the second liquid is controlled by controlling the temperatures of the first liquid and the second liquid.

12. The method of claim 1 in which dipping the sample in the first liquid in a vacuum chamber of the particle-optical apparatus, thereby causing the sample surface layer to be etched comprises controlling the amount of etching by controlling the submerging time, the first liquid concentration, or the first liquid temperature.

13. The method of claim 1 in which the etchant comprises KOH, HClO4, butoxyethanol, NaOH, or H3PO4.

Assignees

• Fei Co

Inventors

• Vystavel Tomas
• Botman Aurelien Philippe Jean Maclou

Classifications

• H10P70/00

  Cleaning of wafers, substrates or parts of devices · CPC title

• H10P50/642

  Chemical etching · CPC title

• H10P14/412

  Deposition of metallic or metal-silicide materials · CPC title

• H01J2237/2067

  Surface alteration · CPC title

• B05D5/00

  Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures · CPC title