Method and apparatus for preventing the deformation of a substrate supported at its edge area

Patent metadata

Field	Value
Publication number	US-10103049-B2
Application number	US-201515117930-A
Country	US
Kind code	B2
Filing date	Feb 11, 2015
Priority date	Feb 11, 2014
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

The method and the apparatus prevents the deformation of a substrate, e.g. a wafer, supported with its edge area or periphery at a support or chuck, and also avoids the damage and/or contamination of the active area of the substrate. In particular, the substrate is mechanically supported at its peripheral or edge portion, namely in the non-active area of the substrate, only; an additional non-mechanical extended support is provided in the active area by a gas cushion. The gas cushion is generated by a controllable nozzle or purge for a distinct and controlled compensation of the downward deflection of the substrate.

First claim

The invention claimed is:

1. A method for supporting a substrate on a support, said method comprising:
providing a support having an edge portion and an inner portion;
placing a substrate having an inner area and an edge area surrounding the inner area on said support, wherein the edge area of the substrate is in contact with the edge portion of the support and the inner portion of the support faces the inner area of the substrate and is not in mechanical contact with the substrate; and
generating a gas cushion between the inner portion of the support and the substrate, wherein the gas cushion is generated by means of a controllable nozzle supplied with a gas, a gas flow through the nozzle being controlled depending on a property selected from the group consisting of a desired or required shape of the substrate, a dimension of the nozzle, a distance between a tip of the nozzle and the substrate, and a size of a gap of the support, and wherein
the gas cushion deflects the substrate in a controlled manner, wherein the controlled manner is selected from the group consisting of contactlessly compensating a downward bending and creating an upward convex bending.

2. The method of claim 1 , wherein contact between the edge area of the substrate and the edge portion of the support is provided by means of vacuum suction.

3. The method of claim 1 , wherein the gas cushion is arranged coaxially to at least one of the support and the substrate.

4. The method of claim 1 , wherein excess gas from the gas cushion is discharged from the support via openings.

5. The method of claim 1 , wherein an upward directed force generated by gas of the gas cushion and acting on a downward facing surface of the substrate decreases from a location of the nozzle towards the edge portion of the support and contributes to compensation of a downward deflection of the substrate.

6. An apparatus for performing the method of claim 1 , the apparatus comprising the support, wherein the inner portion of the support is lower than an upper surface of the edge portion of the support and the apparatus further comprises means for providing the gas cushion between the inner portion of the support and the inner area of the substrate, wherein the gas cushion deflects the substrate in a controlled manner, wherein the controlled manner is selected from the group consisting of contactlessly compensating a downward bending and creating an upward convex bending.

7. The apparatus of claim 6 , wherein the means for providing the gas cushion is arranged coaxially to at least one of the support and the substrate.

8. The apparatus of claim 6 , wherein the edge portion of the support comprises apertures connected to a vacuum means for vacuum suction of the edge area of the substrate to the edge portion of the support.

9. The apparatus of claim 6 , wherein the support further comprises openings arranged therein for discharging excess gas from the gas cushion.

10. The apparatus of claim 9 , wherein the openings for discharging excess gas are arranged close to the edge portion of the support.

11. A method for supporting a substrate on a support, said method comprising:
providing a support having an edge portion and an inner portion;
placing a substrate having an inner area and an edge area surrounding the inner area on said support, wherein the edge area of the substrate is in contact with the edge portion of the support and the inner portion of the support faces the inner area of the substrate and is not in mechanical contact with the substrate, wherein a downward bending of the substrate occurs due to a feature selected from the group consisting of gravity and an air cushion built-up between the substrate and a mask; and
generating a gas cushion between the inner portion of the support and the substrate, wherein the gas cushion is generated by means of a controllable nozzle supplied with a gas and gas flow through the nozzle is controlled depending on a property selected from the group consisting of a desired or required shape of the substrate, one or more dimensions of the nozzle, a distance between a tip of the nozzle and the substrate, and a size of a gap of the support, wherein
the gas cushion deflects the substrate in a controlled manner, wherein the controlled manner is selected from the group consisting of contactlessly compensating a downward bending and creating an upward convex bending.

Assignees

• Suss Microtec Lithography Gmbh

Inventors

• Bogner Bernhard

Classifications

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• B25J15/0014

  having fork, comb or plate shaped means for engaging the lower surface on a object to be transported · CPC title

• H01L21/6838 Primary

  Electricity · mapped topic

• H01L21/67288

  Electricity · mapped topic